1.53 MP MONO Global 73 - Degree View Shutter Camera Module VD56G3 Sensor For Machine Vision

1.53 MP MONO Global 73 - Degree View Shutter Camera Module VD56G3 Sensor For Machine Vision

1. Basic Parameters:

‑ Resolution: 1124 (H) × 1346 (V), 1.53MP. It delivers fine‑grained image quality, accurately captures image details, and meets the requirements for medium‑to‑high‑precision visual inspection and imaging.

‑ Pixel Size: 2.61μm (H) × 2.61μm. Adopting advanced pixel technology, it greatly enlarges the photosensitive area and improves photoelectric conversion efficiency, effectively boosting imaging performance under low‑light conditions.

‑ Optical Format: 1/4‑inch. It supports miniaturized and lightweight device designs, significantly reduces the overall size of vision systems, and suits integration with various compact embedded devices.

‑ Supply Voltage: Core voltage 1.15V, interface voltage 1.8V, analog voltage 2.8V. It operates stably under diverse voltage conditions and ensures sensor reliability.

‑ Temperature Range: Operating temperature ranges from ‑30℃ to 85℃. Its wide operating temperature range enables adaptation to various working environments.

2. Technical Features:

‑ Global Shutter Technology: The global‑shutter design effectively eliminates motion blur and illumination artifacts while lowering power consumption requirements for lighting.

‑ It integrates three core proprietary technologies: BSI (Back‑Side Illumination), full CDTI (Continuous Digital Time Integration), and 3D stacking. It achieves ultra‑high Quantum Efficiency (QE), excellent Modulation Transfer Function (MTF) and angular response characteristics. It outputs high‑sharpness and high‑purity images for visible light as well as 850 nm and 940 nm near‑infrared bands, with outstanding imaging performance in low‑light and complex‑lighting scenarios.

‑ It adopts compact bare‑die packaging for robust mechanical performance. Passing strict industrial‑grade reliability tests, it features strong anti‑interference and temperature‑resistance capabilities. No imaging stuttering or image quality degradation occurs during long‑term continuous operation, making it suitable for long‑hour high‑frequency industrial applications.

‑ VD56G3 Camera Module: Compatible with standard modules with various lens configurations such as 73° to satisfy diverse customer requirements.

3. Application Fields:

Applied in virtual reality / augmented reality, biometric identification, drones, smart home, IoT devices, 3D imaging, machine vision, barcode scanning, factory automation and other fields.

4. Customization Services:

Custom modules can be produced according to customer requirements to deliver tailor‑made products matching customers’ specific needs.

Chongqing Zhongshun Microelectronics Co., Ltd., founded in 2018 and located in Dazu District, Chongqing, is a key science and innovation-based manufacturing enterprise cultivated by the local government. Focusing on semiconductor packaging and testing, MEMS micro-electromechanical devices, as well as optoelectronic and environmental sensors, the company integrates research and development, design, large-scale production and sales, with its core business serving three major tracks: automotive electronics, intelligent equipment and industrial Internet of Things.

1. The company specializes in customized packaging services for mainstream plastic packaging products including BGA, LGA, DFN and QFN, as well as PLCC and MEMS micro-electromechanical devices. It has built a core technical team with extensive practical industrial experience and established a nationwide market service network through branches across multiple regions. As a highly promising backbone player within Chongqing’s semiconductor industrial cluster, it focuses on customized solutions featuring high reliability, small-batch and multi-batch production, which precisely meet stringent technical requirements for vehicle-mounted and industrial scenarios, forming core competitive advantages that distinguish it from large industrial manufacturers.

2. The company delves deep into advanced packaging and sensor integration processes. Its self-developed micro-module connection technology and high-precision sensor packaging technology have been successfully applied in industrial inspection, vehicle-mounted environment perception and other scenarios, providing low-cost, high-reliability pilot test and mass production packaging channels for small and medium-sized chip design enterprises. Meanwhile, leveraging the R&D mechanism for high-tech enterprises, the company continuously shares technical practices such as process optimization and yield improvement with the industry, serving as a technical demonstration platform for the segmented semiconductor sector in Southwest China.

3. The company has successively been awarded titles including National High-tech Enterprise, National Science and Technology-based Small and Medium-sized Enterprise, and Provincial Specialized, Refined, Unique and Innovative Small and Medium-sized Enterprise. It maintains important cooperative ties with the Chinese Academy of Sciences and holds dozens of patents, trademarks and administrative licenses in total. Supported by solid technical reserves and compliant operation capabilities, it ranks among top-quality local enterprises in Chongqing’s microelectronics and sensor industries. Committed to basing its operations in Chongqing, expanding nationwide and connecting with global markets, the company aims to become a benchmark specialized, refined, unique and innovative enterprise in automotive electronic packaging & testing and MEMS sensor sectors across Southwest China. It strives to build an integrated industrial ecosystem featuring "independent R&D, intelligent manufacturing and full-range services", break certain import technical barriers in advanced packaging and industrial sensing fields, and grow into a hidden champion with core pricing power and technological leadership within its segmented tracks.