0.38 MP MONO Global 79.8 - Degree View Shutter Camera Module VD55G0 Sensor For Machine Vision

0.38 MP MONO Global 79.8 - Degree View Shutter Camera Module VD55G0 Sensor For Machine Vision

1. Basic Parameters:

‑ Resolution: 644(H)×604(V), 0.38MP. It delivers balanced and full‑bodied imaging, meeting high‑precision visual acquisition requirements for small‑to‑medium fields of view and fitting most lightweight vision application scenarios.

‑ Pixel Size: 2.61μm(H)×2.61μm(V). Equipped with a back‑illuminated photosensitive structure and deep trench isolation technology, it achieves high pixel photosensitivity and excellent noise control, effectively improving overall imaging sharpness and dynamic performance.

‑ Optical Format: 1/9‑inch. It supports optional wide‑angle and standard lenses, is compatible with various optical path designs, and offers flexible field‑of‑view adaptation to satisfy framing and mounting requirements of different devices.

‑ Supply Voltage: Core voltage 1.15V, interface voltage 1.8V, analog voltage 2.8V. It operates stably under various voltage conditions to guarantee sensor reliability.

‑ Temperature Range: Operating temperature ranges from ‑30℃ to 85℃. Its wide operating temperature range enables adaptation to diverse working environments.

2. Technical Features:

‑ Global Shutter Technology: The global‑shutter design effectively eliminates motion blur and illumination artifacts while lowering lighting power consumption requirements.

‑ Built‑in ultra‑low‑power detection and wake‑up architecture delivers outstanding power consumption performance, making it suitable for battery‑powered portable devices. It integrates on‑chip image processing functions including auto‑exposure, noise reduction, defect correction and pixel binning to optimize image quality without additional external chips. It supports high‑speed single‑lane MIPI CSI‑2 output as well as dual I²C/I3C control interfaces for fast connection with various embedded main controllers and MCUs, featuring strong compatibility.

‑ Optimized near‑infrared photosensitivity brings excellent quantum efficiency. It produces clear low‑light images with low noise, and supports high‑quality daytime imaging as well as low‑light and infrared‑aided imaging for strong environmental adaptability.

‑ VD55G0 MONO Camera Module: Standard modules compatible with lens configurations such as 79.8° are available to meet diverse customer requirements.

3. Application Fields:

Applied in virtual reality / augmented reality, biometric identification, drones, smart home, IoT devices, 3D imaging, machine vision, barcode scanning, factory automation and other fields.

4. Customization Services:

Custom modules can be produced according to customer requirements to deliver tailor‑made products matching specific demands.

Chongqing Zhongshun Microelectronics Co., Ltd., founded in 2018 and located in Dazu District, Chongqing, is a key science and innovation-based manufacturing enterprise cultivated by the local government. Focusing on semiconductor packaging and testing, MEMS micro-electromechanical devices, as well as optoelectronic and environmental sensors, the company integrates research and development, design, large-scale production and sales, with its core business serving three major tracks: automotive electronics, intelligent equipment and industrial Internet of Things.

1. The company specializes in customized packaging services for mainstream plastic packaging products including BGA, LGA, DFN and QFN, as well as PLCC and MEMS micro-electromechanical devices. It has built a core technical team with extensive practical industrial experience and established a nationwide market service network through branches across multiple regions. As a highly promising backbone player within Chongqing’s semiconductor industrial cluster, it focuses on customized solutions featuring high reliability, small-batch and multi-batch production, which precisely meet stringent technical requirements for vehicle-mounted and industrial scenarios, forming core competitive advantages that distinguish it from large industrial manufacturers.

2. The company delves deep into advanced packaging and sensor integration processes. Its self-developed micro-module connection technology and high-precision sensor packaging technology have been successfully applied in industrial inspection, vehicle-mounted environment perception and other scenarios, providing low-cost, high-reliability pilot test and mass production packaging channels for small and medium-sized chip design enterprises. Meanwhile, leveraging the R&D mechanism for high-tech enterprises, the company continuously shares technical practices such as process optimization and yield improvement with the industry, serving as a technical demonstration platform for the segmented semiconductor sector in Southwest China.

3. The company has successively been awarded titles including National High-tech Enterprise, National Science and Technology-based Small and Medium-sized Enterprise, and Provincial Specialized, Refined, Unique and Innovative Small and Medium-sized Enterprise. It maintains important cooperative ties with the Chinese Academy of Sciences and holds dozens of patents, trademarks and administrative licenses in total. Supported by solid technical reserves and compliant operation capabilities, it ranks among top-quality local enterprises in Chongqing’s microelectronics and sensor industries. Committed to basing its operations in Chongqing, expanding nationwide and connecting with global markets, the company aims to become a benchmark specialized, refined, unique and innovative enterprise in automotive electronic packaging & testing and MEMS sensor sectors across Southwest China. It strives to build an integrated industrial ecosystem featuring "independent R&D, intelligent manufacturing and full-range services", break certain import technical barriers in advanced packaging and industrial sensing fields, and grow into a hidden champion with core pricing power and technological leadership within its segmented tracks.