0.56 MP RGB Global 160 - Degree View Shutter Camera Module VD65G4 Sensor For Machine Vision

0.56 MP RGB Global 160 - Degree View Shutter Camera Module VD65G4 Sensor For Machine Vision

1. Basic Parameters:

- Resolution: 804(H)×704(V), 0.56MP. It supports high‑speed full‑resolution frame output up to 184 fps, which can accurately capture fast‑moving scenes without motion blur or distortion.

- Pixel Size: 2.16 μm(H)×2.16 μm(V), adopting industry‑leading pixel technology. The pixel array has a diagonal of 2.3 mm. Featuring an ultra‑compact form factor, it suits the integration and installation requirements of various miniaturized and lightweight devices.

- Optical Format: 1/9‑inch. Built with BSI back‑illuminated, CDTI technology and 3D stacking process, it delivers excellent light‑sensing performance and optical response.

- Supply Voltage: Core voltage 1.15 V, interface voltage 1.8 V, analog voltage 2.8 V. It operates stably under various voltage conditions to ensure sensor reliability.

- Temperature Range: Operating temperature ranges from ‑30 ℃ to 85 ℃. Its wide operating temperature range enables adaptation to diverse working environments.

2. Technical Features:

- Global Shutter Technology: The global‑shutter design effectively eliminates motion blur and illumination artifacts while lowering power consumption requirements for lighting.

- Built‑in full‑set intelligent image‑processing algorithms integrate core functions including auto‑exposure, intelligent noise reduction, pixel defect correction, multi‑exposure optimization and auto‑white balance. High‑quality RAW8 and RAW10 image data can be directly output without an external image‑processing chip. It also supports professional vision functions such as 4×4 frame statistics output, event‑like frame output and background subtraction. These functions can rapidly distinguish foreground targets from background environments, significantly reduce the computing load of downstream main‑control MCUs and NPUs, shorten imaging response latency and improve overall equipment operational efficiency.

- Leveraging advanced semiconductor processes including 3D stacking, BSI back‑illumination and CDTI, it achieves ultra‑miniaturized design while preserving imaging performance. The chip features small dimensions and compact structure, alongside favorable photoelectric conversion efficiency and angular response characteristics, strong anti‑interference capability and consistent imaging quality. It is suitable for device integration scenarios with confined space.

- VD65G4 RGB Camera Module: Standard modules compatible with various lens configurations such as 179°, 160° and 81° to meet diverse customer requirements.

3. Application Fields:

Applied to virtual reality / augmented reality, biometric identification, drones, smart home, IoT devices, 3D imaging, machine vision, barcode scanning, factory automation and other fields.

4. Personalized Customization Services:

Custom modules can be produced according to customer requirements to deliver tailor‑made products matching specific demands.

Chongqing Zhongshun Microelectronics Co., Ltd., founded in 2018 and located in Dazu District, Chongqing, is a key science and innovation-based manufacturing enterprise cultivated by the local government. Focusing on semiconductor packaging and testing, MEMS micro-electromechanical devices, as well as optoelectronic and environmental sensors, the company integrates research and development, design, large-scale production and sales, with its core business serving three major tracks: automotive electronics, intelligent equipment and industrial Internet of Things.

1. The company specializes in customized packaging services for mainstream plastic packaging products including BGA, LGA, DFN and QFN, as well as PLCC and MEMS micro-electromechanical devices. It has built a core technical team with extensive practical industrial experience and established a nationwide market service network through branches across multiple regions. As a highly promising backbone player within Chongqing’s semiconductor industrial cluster, it focuses on customized solutions featuring high reliability, small-batch and multi-batch production, which precisely meet stringent technical requirements for vehicle-mounted and industrial scenarios, forming core competitive advantages that distinguish it from large industrial manufacturers.

2. The company delves deep into advanced packaging and sensor integration processes. Its self-developed micro-module connection technology and high-precision sensor packaging technology have been successfully applied in industrial inspection, vehicle-mounted environment perception and other scenarios, providing low-cost, high-reliability pilot test and mass production packaging channels for small and medium-sized chip design enterprises. Meanwhile, leveraging the R&D mechanism for high-tech enterprises, the company continuously shares technical practices such as process optimization and yield improvement with the industry, serving as a technical demonstration platform for the segmented semiconductor sector in Southwest China.

3. The company has successively been awarded titles including National High-tech Enterprise, National Science and Technology-based Small and Medium-sized Enterprise, and Provincial Specialized, Refined, Unique and Innovative Small and Medium-sized Enterprise. It maintains important cooperative ties with the Chinese Academy of Sciences and holds dozens of patents, trademarks and administrative licenses in total. Supported by solid technical reserves and compliant operation capabilities, it ranks among top-quality local enterprises in Chongqing’s microelectronics and sensor industries. Committed to basing its operations in Chongqing, expanding nationwide and connecting with global markets, the company aims to become a benchmark specialized, refined, unique and innovative enterprise in automotive electronic packaging & testing and MEMS sensor sectors across Southwest China. It strives to build an integrated industrial ecosystem featuring "independent R&D, intelligent manufacturing and full-range services", break certain import technical barriers in advanced packaging and industrial sensing fields, and grow into a hidden champion with core pricing power and technological leadership within its segmented tracks.