5.08 MP MONO Global 120 - Degree View Shutter Camera Module VD5943 Sensor For Machine Vision

5.08 MP MONO Global 120 - Degree View Shutter Camera Module VD5943 Sensor For Machine Vision

1. Basic Parameters:

‑ Resolution: 2560 (H) × 1984 (V), 5.08MP. It delivers clear and delicate images, accurately capturing scene details to meet high‑precision image acquisition requirements.

‑ Pixel Size: 2.25μm (H) × 2.25μm. Combined with Back‑Side Illumination (BSI) pixel technology and ST‑patented CDTI technology, it greatly improves the sensor’s light‑sensing capability and imaging sharpness, while optimizing the Modulation Transfer Function (MTF) performance of the image.

‑ Optical Format: 1/2.5‑inch. Compatible with mainstream lens modules, it features strong compatibility and can flexibly adapt to the structural design and optical path layout of various embedded vision devices.

‑ Supply Voltage: Core voltage 1.15V, interface voltage 1.8V, analog voltage 2.8V. It can operate stably under various voltage conditions to ensure sensor reliability.

‑ Temperature Range: Operating temperature ranges from ‑30℃ to 85℃. With a wide operating temperature range, it can adapt to diverse working environments.

2. Technical Features:

‑ Global Shutter Technology: Equipped with a dual‑mode switching architecture for global shutter and rolling shutter, it can automatically adapt the imaging mode according to scenarios. In global shutter mode, it supports full‑resolution imaging at up to 100 fps, completely eliminating jelly effect and motion artifacts for high‑speed moving objects, suitable for high‑speed dynamic scene capture. In rolling shutter mode, it achieves 50 fps imaging with ultra‑low dark noise for better image quality in static and conventional scenarios, balancing dynamic capture accuracy and static imaging texture.

‑ Adopting ST self‑developed 3D stacked packaging process and back‑side illuminated pixel structure, the pixel photoelectric conversion efficiency is significantly enhanced, with outstanding near‑infrared light‑sensing performance for low‑light and night‑vision imaging scenarios. Meanwhile, the chip delivers higher integration and compact size. It reduces module dimensions and effectively lowers system power consumption, making it suitable for battery‑powered portable devices.

‑ VD5943 Camera Module: Compatible with standard modules with various lens configurations such as 120°, to satisfy diverse customer requirements.

3. Application Fields:

Applicable to industries including Virtual Reality / Augmented Reality, biometric identification, drones, smart home, IoT devices, 3D imaging, machine vision, barcode scanning, and factory automation.

4. Customization Services:

Custom modules can be produced on demand to deliver tailor‑made products for customers.

Chongqing Zhongshun Microelectronics Co., Ltd., founded in 2018 and located in Dazu District, Chongqing, is a key science and innovation-based manufacturing enterprise cultivated by the local government. Focusing on semiconductor packaging and testing, MEMS micro-electromechanical devices, as well as optoelectronic and environmental sensors, the company integrates research and development, design, large-scale production and sales, with its core business serving three major tracks: automotive electronics, intelligent equipment and industrial Internet of Things.

1. The company specializes in customized packaging services for mainstream plastic packaging products including BGA, LGA, DFN and QFN, as well as PLCC and MEMS micro-electromechanical devices. It has built a core technical team with extensive practical industrial experience and established a nationwide market service network through branches across multiple regions. As a highly promising backbone player within Chongqing’s semiconductor industrial cluster, it focuses on customized solutions featuring high reliability, small-batch and multi-batch production, which precisely meet stringent technical requirements for vehicle-mounted and industrial scenarios, forming core competitive advantages that distinguish it from large industrial manufacturers.

2. The company delves deep into advanced packaging and sensor integration processes. Its self-developed micro-module connection technology and high-precision sensor packaging technology have been successfully applied in industrial inspection, vehicle-mounted environment perception and other scenarios, providing low-cost, high-reliability pilot test and mass production packaging channels for small and medium-sized chip design enterprises. Meanwhile, leveraging the R&D mechanism for high-tech enterprises, the company continuously shares technical practices such as process optimization and yield improvement with the industry, serving as a technical demonstration platform for the segmented semiconductor sector in Southwest China.

3. The company has successively been awarded titles including National High-tech Enterprise, National Science and Technology-based Small and Medium-sized Enterprise, and Provincial Specialized, Refined, Unique and Innovative Small and Medium-sized Enterprise. It maintains important cooperative ties with the Chinese Academy of Sciences and holds dozens of patents, trademarks and administrative licenses in total. Supported by solid technical reserves and compliant operation capabilities, it ranks among top-quality local enterprises in Chongqing’s microelectronics and sensor industries. Committed to basing its operations in Chongqing, expanding nationwide and connecting with global markets, the company aims to become a benchmark specialized, refined, unique and innovative enterprise in automotive electronic packaging & testing and MEMS sensor sectors across Southwest China. It strives to build an integrated industrial ecosystem featuring "independent R&D, intelligent manufacturing and full-range services", break certain import technical barriers in advanced packaging and industrial sensing fields, and grow into a hidden champion with core pricing power and technological leadership within its segmented tracks.