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10mil RF-10 PCB 2-Layer Rigid Board High-DK Low-Loss

Categories RF PCB Board
Brand Name: Bicheng
Model Number: BIC-332.V1.0
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Price: USD9.99-99.99
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
PCB material: RF-10
PCB thickness: 0.5mm
Layer count: 2-layer
PCB size: 143.6mm x 109.8mm (2 Types, 2 PCS)
Copper weight: 1oz (1.4 mils) on outer layers (35μm)
Surface finish: ENEPIG
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10mil RF-10 PCB 2-Layer Rigid Board High-DK Low-Loss

Looking for a high-performance 2-layer rigid PCB optimized for RF applications? This 2-layer rigid PCB is built with RF-10 copper clad laminates—a composite of ceramic-filled PTFE and woven fiberglass—designed to address the growing need for size reduction in RF applications while maintaining superior signal integrity. Engineered to IPC-Class 2 quality standards, this PCB delivers reliable performance for critical applications like microstrip patch antennas, GPS antennas, and satellite components. With a focus on precision, durability, and cost-effectiveness, this PCB is ideal for engineers and procurement teams seeking a reliable substrate for high-frequency projects.


PCB Specifications

Every aspect of our PCB is engineered for precision and performance, ensuring consistency and reliability in every unit:

Construction ItemDetails
Board Dimensions143.6mm x 109.8mm (2 Types, 2 PCS), with a tight tolerance of +/- 0.15mm for precise fit in your assemblies
Trace & SpaceMinimum 5/7 mils, enabling compact circuit design without compromising signal integrity
Minimum Hole Size0.4mm, compatible with standard component mounting requirements
ViasNo blind vias, simplifying manufacturing while ensuring reliable interlayer connections
Finished Board Thickness0.5mm, balancing durability and space efficiency for compact devices
Copper Weight1oz (1.4 mils) on outer layers (35μm), providing excellent conductivity for high-frequency signals
Via Plating Thickness20μm, meeting IPC-Class 2 standards for reliable electrical connections and mechanical strength
Surface FinishENEPIG, offering superior solderability, corrosion resistance, and compatibility with modern assembly techniques compared to standard finishes like ENIG
Silkscreen & Solder MaskNo top or bottom silkscreen, no top or bottom solder mask, ensuring a clean design optimized for RF signal performance
Quality Testing100% electrical test performed prior to shipment, guaranteeing functionality and eliminating defective units

PCB Stack-up Configuration

Stack-up ComponentSpecifications & Description
Copper Layer 135μm (1oz) – Ensures efficient signal transmission and thermal conductivity
RF-10 Core10mil (0.254mm) – The foundation of the PCB’s superior RF performance
Copper Layer 235μm (1oz) – Provides consistent conductivity and symmetry for balanced signal flow

PCB Statistics

PCB Statistics ItemDetails & Description
Components24 – Accommodates essential components for RF circuits
Total Pads51 – Provides ample connectivity options
Thru Hole Pads34 – Supports reliable through-hole component mounting
Top SMT Pads17 – Enables surface-mount component integration on the top layer
Bottom SMT Pads0 – Optimized for specific component layouts
Vias29 – Ensures secure interlayer connections
Nets2 – Simplifies circuit routing while maintaining signal integrity


RF-10 Substrate: Key to Superior Performance

RF-10 copper clad laminates are the cornerstone of our PCB’s exceptional performance, engineered to meet the demands of high-frequency RF applications:


RF-10 is a composite of ceramic-filled PTFE and woven fiberglass, offering a unique combination of high dielectric constant (DK) and low dissipation factor—critical for reducing signal loss at higher frequencies. The thin woven fiberglass reinforcement enhances rigidity for easier handling and improved dimensional stability, making it ideal for both single-layer and multilayer circuits.


Engineered for cost-effectiveness and industry-acceptable delivery times, RF-10 addresses the need for size reduction in RF applications. Its excellent bonding with smooth low-profile copper, combined with low dissipation, results in optimal insertion losses at higher frequencies where skin effect losses are significant.


Key Features of RF-10 PCB

Our RF-10 2-layer PCB boasts industry-leading features that set it apart for high-frequency applications:


Dielectric Constant: 10.2 ± 0.3 at 10GHz – Enables compact RF circuit design


Dissipation Factor: 0.0025 at 10GHz – Minimizes signal loss for reliable high-frequency performance


High Thermal Conductivity: 0.85 W/mk (Unclad) – Enhances thermal management, preventing overheating in high-power applications


CTE (Coefficient of Thermal Expansion): x=16 ppm/°C, y=20 ppm/°C, z=25 ppm/°C – Low expansion across all axes for excellent dimensional stability


Low Moisture Absorption: 0.08% – Ensures reliability in humid environments


Flammability Rating: V-0 – Meets safety standards for electronic devices


Benefits of Choosing RF-10 PCB

RF-10 PCB delivers tangible advantages for engineers, manufacturers, and procurement teams:


High DK for RF Circuit Size Reduction – Reduces the footprint of your RF designs without sacrificing performance


Excellent Dimensional Stability – Ensures consistent performance across temperature changes and manufacturing processes


Tight DK Tolerance (10.2 +/- 0.3) – Guarantees consistency across all PCBs, simplifying design and assembly


High Thermal Conductivity – Enhances thermal management, extending the lifespan of your devices


Excellent Adhesion to Smooth Coppers – Ensures reliable component bonding and signal transmission


Low X, Y, Z Expansion – Reduces the risk of solder joint failure and board warping


Excellent Price/Performance Ratio – Delivers high-quality RF performance at a cost-effective price point


Applications

Our RF-10 2-layer PCB is specifically designed for high-frequency and high-reliability applications, including:


  • Microstrip Patch Antennas
  • GPS Antennas
  • Passive Components (filters, couplers, power dividers)
  • Aircraft Collision Avoidance Systems
  • Satellite Components

Quality & Availability

Quality Standard: IPC-Class 2 – Meets the industry’s most common quality requirements for dedicated service electronic products, ensuring reliable performance and extended lifespan. IPC-Class 2 is widely used for communication devices, industrial instruments, and other applications requiring consistent performance.


Artwork Format: Gerber RS-274-X – The industry-standard format for PCB manufacturing, ensuring compatibility with all major design and fabrication software.

Availability: Worldwide – We offer global shipping to meet the needs of engineers and manufacturers around the globe, with industry-acceptable delivery times.


China 10mil RF-10 PCB 2-Layer Rigid Board High-DK Low-Loss factory
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