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Rogers RO3003 High Frequency PCB 2-Layer Rogers 3003 10mil Circuit Board DK3.0 DF 0.001 Microwave PCB

Categories RF PCB Board
Brand Name: Bicheng
Model Number: BIC-037.V1.0
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Price: USD9.99-99.99
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Base material: RO3003
Layer count: 2 layers
PCB size: 100 x 100mm=1PCS
PCB thickness: 0.3mm
Copper weight: 1oz
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Rogers RO3003 High Frequency PCB 2-Layer Rogers 3003 10mil Circuit Board DK3.0 DF 0.001 Microwave PCB


Rogers RO3003 High Frequency PCB 2-Layer Rogers 3003 10mil Circuit Board DK3.0 DF 0.001 Microwave PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


Rogers RO3003 high-frequency circuit materials are ceramic-filled PTFE composites specifically designed for commercial microwave and RF applications. These materials offer exceptional electrical and mechanical stability while maintaining competitive prices. The consistent mechanical properties of RO3003 allow designers to develop multi-layer board designs without encountering warpage or reliability issues.


RO3003 materials exhibit a coefficient of thermal expansion (CTE) of 17 ppm/℃ in the X and Y axes. This CTE is matched to that of copper, ensuring excellent dimensional stability. After etching and baking processes, RO3003 materials typically experience minimal etch shrinkage of less than 0.5 mils per inch, further enhancing their dimensional stability.


Furthermore, RO3003 laminates have a Z-axis CTE of 24 ppm/℃. This characteristic contributes to exceptional plated through-hole reliability, even in harsh environments, ensuring robust and reliable performance.


Rogers RO3003 high-frequency circuit materials provide exceptional electrical and mechanical stability, making them ideal for applications such as datalink on cable systems, patch antennas for wireless communications, power backplanes, and remote meter readers.


PCB Specifications

PCB SIZE100 x 100mm=1PCS
BOARD TYPEDouble sided PCB
Number of Layers2 layers
Surface Mount ComponentsNO
Through Hole ComponentsNO
LAYER STACKUPcopper ------- 35 um(1 oz)
RO3003 0.254mm
copper ------- 35 um(1 oz)
TECHNOLOGY
Minimum Trace and Space:5mil / 5mil
Minimum / Maximum Holes:0.3mm / 0.8mm
Number of Different Holes:N/A
Number of Drill Holes:N/A
Number of Milled Slots:N/A
Number of Internal Cutouts:N/A
Impedance Control:N/A
Number of Gold finger:N/A
BOARD MATERIAL
Glass Epoxy:RO3003 0.254mm
Final foil external:1oz
Final foil internal:N/A
Final height of PCB:0.3 mm ±0.1
PLATING AND COATING
Surface FinishN/A
Solder Mask Apply To:N/A
Solder Mask Color:N/A
Solder Mask Type:N/A
CONTOUR/CUTTINGRouting
MARKING
Side of Component LegendN/A
Colour of Component LegendN/A
Manufacturer Name or Logo:N/A
VIAN/A
FLAMIBILITY RATINGUL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:0.0059"
Board plating:0.0029"
Drill tolerance:0.002"
TESTN/A
TYPE OF ARTWORK TO BE SUPPLIEDemail file, Gerber RS-274-X, PCBDOC etc
SERVICE AREAWorldwide, Globally.

Data Sheet of Rogers 3003 (RO3003)

RO3003 Typical Value
PropertyRO3003DirectionUnitsConditionTest Method
Dielectric Constant,εProcess3.0±0.04Z10 GHz/23IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign3Z8GHz to 40 GHzDifferential Phase Length Method
Dissipation Factor,tanδ0.001Z10 GHz/23IPC-TM-650 2.5.5.5
Thermal Coefficient of ε-3Zppm/10 GHz -50to 150IPC-TM-650 2.5.5.5
Dimensional Stability0.06
0.07
X
Y
mm/mCOND AIPC-TM-650 2.2.4
Volume Resistivity107MΩ.cmCOND AIPC 2.5.17.1
Surface Resistivity107COND AIPC 2.5.17.1
Tensile Modulus930
823
X
Y
MPa23ASTM D 638
Moisture Absorption0.04%D48/50IPC-TM-650 2.6.2.1
Specific Heat0.9j/g/kCalculated
Thermal Conductivity0.5W/M/K50ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288
)
17
16
25
X
Y
Z
ppm/23/50% RHIPC-TM-650 2.4.4.1
Td500 TGAASTM D 3850
Density2.1gm/cm323ASTM D 792
Copper Peel Stength12.7Ib/in.1oz,EDC After Solder FloatIPC-TM 2.4.8
FlammabilityV-0UL 94
Lead-free Process CompatibleYes


China Rogers RO3003 High Frequency PCB 2-Layer Rogers 3003 10mil Circuit Board DK3.0 DF 0.001 Microwave PCB factory
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