Sign In | Join Free | My chinacomputerparts.com
chinacomputerparts.com
Products
Search by Category
Home > Other Fabrication Services >

Rogers RO3006 High Frequency Printed Circuit Board 2-Layer Rogers 3006 10mil PCB DK6.15 DF 0.002 Microwave Gold PCB

Categories RF PCB Board
Brand Name: Bicheng
Model Number: BIC-045.V1.0
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Price: USD9.99-99.99
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Base material: RO3006
Layer count: 2 layers
PCB thickness: 0.3mm
PCB size: 152 x 152mm=1PCS
Copper weight: 0.5oz
Surface finish: immersion gold
  • Haven't found right suppliers
  • Our buyer assistants can help you find the most suitable, 100% reliable suppliers from China.
  • And this service is free of charge.
  • we have buyer assistants who speak English, French, Spanish......and we are ready to help you anytime!
Submit Buying Request
  • Product Details
  • Company Profile

Rogers RO3006 High Frequency Printed Circuit Board 2-Layer Rogers 3006 10mil PCB DK6.15 DF 0.002 Microwave Gold PCB


Rogers RO3006 High Frequency Printed Circuit Board 2-Layer Rogers 3006 10mil PCB DK6.15 DF 0.002 Microwave Gold PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


Rogers RO3006 circuit materials are composite materials made of ceramic-filled PTFE, specifically designed for use in commercial microwave and RF applications. These materials offer excellent electrical and mechanical stability while remaining cost-effective. Their consistent mechanical properties enable the development of multi-layer board designs without encountering issues such as warping or reliability problems. The coefficient of thermal expansion (CTE) of RO3006 materials in the X and Y axis is 17 ppm/℃, which is well-matched to that of copper. This compatibility ensures excellent dimensional stability, with minimal etch shrinkage of less than 0.5 mils per inch after etching and baking. In the Z-axis, the CTE is 24 ppm/℃, providing exceptional reliability for plated through-holes, even in harsh environments.


Here are some typical applications of RO3006 materials:

1) Automotive radar
2) Datalink on cable systems
3) Patch antenna for wireless communications
4) Power amplifiers and antennas
5) Remote meter readers


PCB Specifications

PCB SIZE152 x 152mm=1PCS
BOARD TYPEDouble sided PCB
Number of Layers2 layers
Surface Mount ComponentsYES
Through Hole ComponentsYES
LAYER STACKUPcopper ------- 18um(0.5 oz)+plate TOP layer
RO3006 0.254mm
copper ------- 18um(0.5 oz) + plate BOT Layer
TECHNOLOGY
Minimum Trace and Space:14 mil / 14 mil
Minimum / Maximum Holes:0.4 mm / 4.0 mm
Number of Different Holes:1
Number of Drill Holes:1
Number of Milled Slots:0
Number of Internal Cutouts:0
Impedance Control:no
Number of Gold finger:0
BOARD MATERIAL
Glass Epoxy:RO3006 0.254mm
Final foil external:1 oz
Final foil internal:N/A
Final height of PCB:0.3 mm ±0.1mm
PLATING AND COATING
Surface FinishImmersion Gold
Solder Mask Apply To:N/A
Solder Mask Color:N/A
Solder Mask Type:N/A
CONTOUR/CUTTINGRouting
MARKING
Side of Component LegendN/A
Colour of Component LegendN/A
Manufacturer Name or Logo:N/A
VIAPlated through hole(PTH), minimum size 0.4mm.
FLAMIBILITY RATINGUL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:0.0059"
Board plating:0.0029"
Drill tolerance:0.002"
TEST100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIEDemail file, Gerber RS-274-X, PCBDOC etc
SERVICE AREAWorldwide, Globally.


Data Sheet of Rogers 3006 (RO3006)

RO3006 Typical Value
PropertyRO3006DirectionUnitsConditionTest Method
Dielectric Constant,εProcess6.15±0.05Z10 GHz/23IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign6.5Z8GHz to 40 GHzDifferential Phase Length Method
Dissipation Factor,tanδ0.002Z10 GHz/23IPC-TM-650 2.5.5.5
Thermal Coefficient of ε-262Zppm/10 GHz -50to 150IPC-TM-650 2.5.5.5
Dimensional Stability0.27
0.15
X
Y
mm/mCOND AIPC-TM-650 2.2.4
Volume Resistivity105MΩ.cmCOND AIPC 2.5.17.1
Surface Resistivity105COND AIPC 2.5.17.1
Tensile Modulus1498
1293
X
Y
MPa23ASTM D 638
Moisture Absorption0.02%D48/50IPC-TM-650 2.6.2.1
Specific Heat0.86j/g/kCalculated
Thermal Conductivity0.79W/M/K50ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288
)
17
17
24
X
Y
Z
ppm/23/50% RHIPC-TM-650 2.4.4.1
Td500 TGAASTM D 3850
Density2.6gm/cm323ASTM D 792
Copper Peel Stength7.1Ib/in.1oz,EDC After Solder FloatIPC-TM 2.4.8
FlammabilityV-0UL 94
Lead-free Process CompatibleYes

China Rogers RO3006 High Frequency Printed Circuit Board 2-Layer Rogers 3006 10mil PCB DK6.15 DF 0.002 Microwave Gold PCB factory
Send your message to this supplier
 
*From:
*To: Bicheng Electronics Technology Co., Ltd
*Subject:
*Message:
Characters Remaining: (0/3000)
 
Inquiry Cart 0