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| Categories | Automotive PCBA |
|---|---|
| MOQ: | 1 |
| Price: | Contact our PCB engineer |
| Payment Terms: | T/T |
| Layer: | 18 Layer |
| Board Thickness: | 2.5 mm |
| Min. Component Size: | 01005 |
| Surface Finish: | ENIG |
| Pin Space: | 0.1mm |
| Test: | AOI,FCT,ICT |
| Service: | PCBA/SMT/DIP / PCBA Layout and Design |
| Application: | Automobile Control System |
| Company Info. |
| DQS Electronic Co., Limited |
| Verified Supplier |
| View Contact Details |
| Product List |
OEM EV Charger Automotive PCB Assembly GPS Tracker PCBA
♦ What is EV Charger PCB?
An EV Charger PCB is the specialized printed circuit board at the
heart of every electric-vehicle charger.
It is a multi-layer board that mounts and interconnects all the
active and passive components required to draw energy from the
grid, convert it to the correct voltage/current profile, and
deliver it safely to the vehicle’s battery.
| Application | PCB Requirements | Examples |
|---|---|---|
| Engine Control Unit (ECU) | High-temperature resistance, EMI shielding | Fuel injection, ignition timing |
| Infotainment System | High-speed signal integrity, multilayer | Touchscreens, GPS, Bluetooth |
| ADAS (Radar/LiDAR) | RF/microwave PCBs, low-loss materials | Collision avoidance, adaptive cruise control |
| EV Battery Management (BMS) | High-current PCBs, thermal management | Cell balancing, charge monitoring |
| LED Lighting | Aluminum PCBs for heat dissipation | Headlights, interior lightin |
♦ DQS's PCB Assembly Capability
Item | Normal | Special | |||
SMT Assembly | PCB(used for SMT) specification | Length and Width( L* W) | Minimum | L≥3mm, W≥3mm | L<2mm |
Maximum | L≤800mm, W≤460mm | L > 1200mm, W>500mm | |||
Thickness( T) | Thinnest | 0.2mm | T<0.1mm | ||
Thickest | 4 mm | T>4.5mm | |||
SMT components specification | Outline Dimension | Min size | 0201(0.6mm*0.3mm) | 01005(0.3mm*0.2mm) | |
Max size | 200 * 125 | 200 * 125 | |||
component thickness | T≤15mm | 6.5mm<T≤15mm | |||
QFP,SOP,SOJ (multi pins) | Min pin space | 0.4mm | 0.3mm≤Pitch<0.4mm | ||
CSP/ BGA | Min ball space | 0.5mm | 0.3mm≤Pitch<0.5mm | ||
DIP Assembly | PCB specification | Length and Width( L* W) | Minimum | L≥50mm, W≥30mm | L<50mm |
Maximum | L≤1200mm, W≤450mm | L≥1200mm, W≥500mm | |||
Thickness( T) | Thinnest | 0.8mm | T<0.8mm | ||
Thickest | 3.5mm | T>2mm | |||
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