Product Introduction

Microjet laser equipment is an innovative high-precision machining system, which skillfully combines laser technology with liquid jet to achieve precision machining by guiding the laser beam through the liquid medium. This unique design allows it to effectively control heat and avoid material damage during processing, while maintaining extremely high processing accuracy. With intelligent control, advanced multi-axis motion platform and real-time monitoring function, the system can adapt to a variety of processing needs, from semiconductors to superhard materials. Its innovative liquid jet design not only improves the machining quality, but also automatically cleans the machining area, which is especially suitable for production environments with strict cleanliness requirements. The entire system reflects the technical height of modern precision manufacturing and provides a new solution for demanding industrial processing.

Microjet laser processing

Specifications

Microjet laser silicon carbide cut round

Applications

In the field of semiconductor manufacturing, microjet laser equipment has become a key equipment for precision machining of various semiconductor materials by virtue of its unique cold processing characteristics. The technology is widely used in the processing of third-generation semiconductor materials, including the cutting and slicing of silicon carbide (SiC) and gallium nitride (GaN) wafers, which can achieve invisible cutting without chipping, and is especially suitable for the precision machining of ultra-thin wafers. In the field of advanced packaging, the equipment is used for high-precision drilling of 3D IC through-silicon holes (TSV), as well as window opening processes for rewiring layers (RDL), ensuring micron machining accuracy. For emerging ultra-wide bandgap semiconductor materials such as gallium oxide (Ga2O3), microjet laser technology also shows excellent slicing and slicing capabilities. In addition, in the ceramic substrate, aluminum nitride (AlN) and other electronic packaging materials microhole processing, as well as silicon carbide fiber reinforced composite materials and other special materials molding processing, the technology can achieve high-quality non-destructive processing effect, for the semiconductor device miniaturization and high performance to provide a reliable manufacturing solution.

Processing case

ZMSH service

· Customized solution design: Customized equipment configuration according to customer requirements (such as SiC/GaN wafer processing). Process optimization for different materials (semiconductors, ceramics, composites, etc.).

· Process development support: Provide cutting, drilling, etching and other process parameters package. Assist in process testing and optimization of new materials such as Ga₂O₃.

· Equipment installation and training: on-site commissioning and calibration by professional engineers.

Operator technical training (including clean room specifications).

· After-sales maintenance and upgrade: key spare parts inventory assurance (laser, nozzle, etc.). Regular software/hardware upgrades (e.g. femtosecond laser module expansion).