| Sign In | Join Free | My chinacomputerparts.com |
|
| Sign In | Join Free | My chinacomputerparts.com |
|
| Categories | PCM Phase Change Material |
|---|---|
| Brand Name: | Ziitek |
| Model Number: | TIC805G |
| Certification: | RoHS |
| Place of Origin: | China |
| MOQ: | 1000pcs |
| Price: | 0.1-10 USD/PCS |
| Payment Terms: | T/T |
| Supply Ability: | 1000000 pcs/month |
| Delivery Time: | 3-6 work days |
| Packaging Details: | 24*23*12cm |
| Name: | High Performance Phase Change Material PCM Cooling Pad For Heat Pipe Thermal Solutions |
| Color: | Gray |
| Keyword: | Phase Change Materials |
| Feature: | Low melting point |
| Thermal conductivity: | 5W/mK |
| Applicatoin: | Memory Modules |
| Density: | 2.6 g/cc |
| Temperature range: | -40℃～125℃ |
| Company Info. |
| Dongguan Ziitek Electronical Material and Technology Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
High Performance Phase Change Material PCM Cooling Pad For Heat Pipe Thermal Solutions
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!
The TIC™800G Series is low melting point thermal interface material. At 50℃, The TIC™800G Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance. The TIC™800G Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.
The TIC™800G Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does
not fully change state resulting in minimal migration (pump out)at
operating temperatures.
TIC800G Series Datasheet-(E)-REV01.pdf
Features
> 0.014℃-in² /W thermal resistance
> Naturally tacky at room temperature, no adhesive required
> No heat sink preheating required
Applications
> High Frequency Microprocessors
> Notebook and Desktop PCs
> Computer Serves
> Memory Modules
> Cache Chips
> IGBTs
| Typical Properties of TICTM800G Series | |||||
| Product Name | TICTM805G | TICTM808G | TICTM810G | TICTM812G | Test Method |
| Color | Gray | Gray | Gray | Gray | Visual |
| Thickness | 0.005" | 0.008" | 0.010" | 0.012" | **** |
| (0.127mm) | (0.203mm) | (0.254mm) | (0.305mm) | ||
| Thickness Tolerance | ±0.0005'' | ±0.0008'' | ±0.0010'' | ±0.0012'' | **** |
| (±0.127mm) | (±0.203mm) | (±0.0254mm) | (±0.0305mm) | ||
| Density | 2.6g/cc | Helium Pycnometer | |||
| Temperature range | -40℃～125℃ | **** | |||
| Phase Change Softening Temperature | 50℃~60℃ | **** | |||
| Thermal Conductivity | 5.0 W/mK | ASTM D5470 (modified) | |||
| Thermal Impedance @ 50 psi(345 KPa) | 0.014℃-in²/W | 0.020℃-in²/W | 0.038℃-in²/W | 0.058℃-in²/W | ASTM D5470 (modified) |
| 0.09℃-cm²/W | 0.13℃-cm²/W | 0.25℃-cm²/W | 0.37℃-cm²/W | ||
Standard Thicknesses:
0.005"(0.127mm) 0.008"(0.203mm) 0.010"(0.254mm) 0.012"(0.305mm)
Consult the factory alternate thickness.
Standard Sizes:
10" x 16"(254mm x 406mm) 16" x 400'(406mm x 121.92M)
TIC™800 series are supplied with a white release paper and a bottom
liner. TIC™800G series is available in kiss cut an extended pull
tab liner or individual die cut shapes.
Peressure Sensitive Adhesive:
Peressure Sensitive Adhesive is not applicable for TIC™800G series
products.
Reinforcement:
No reinforcement is necessary.
Packaging Details & Lead time
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Independent R&D team
Q: How do I place an order?
A:1. Click the "Sent messages" button to continue with the process.
2. Fill out the message form by entering a subject line, and message to us.
This message should include any questions you might have about the products as well as your purchase requests.
3. Click the "Send" button when you are finished to complete the process and send your message to us
4. We will reply you as soon as possible with Email or online.
|
Gray PCM Phase Change Material Thermal Low Melting Point Memory Modules
2.2g/Cc PCM Phase Change Material Pad Power Semiconductors Laptop Cooling
2.2 g/cc Density Customized Phase Change Thermal Pad for Power Conversion Equipment
Low Thermal Resistance Phase Change Pad For Electronic Components
Cutting-Edge Phase Change Material CPU Cooling for CPU LED Cooling -50C-130C
Highly Phase Change Material with 5.0 W/mK Thermal Conductivity and 50C-60C Phase Transition Temp
High Thermal Conductivity PCM Thermal Interface Material for Netbook and Desktop PCs
China Factory Phase Change Material Pad Phase Change Pad Low Thermal Resistance Phase Change Material
High-Voltage Insulation Thermal Conductive Phase Change Material For Electronic Module
PCM Phase Change Material For Communications Equipment And Wireless Stations
