PCM Phase Change Material For Communications Equipment And Wireless Stations

PCM Phase Change Material For Communications Equipment And Wireless Stations

The TIC™800P Series is low melting point thermal interface material. At 50℃, The TIC™800P Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.

TIC™800P Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.

The TIC™800P Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.

TIC800P-Series-Datasheet.pdf

Features
> 0.024℃-in² /W thermal resistance
> Naturally tacky at room temperature, no adhesive required
> No heat sink preheating required

Applications
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices

Dongguan Ziitek Electronical Material and Technology Ltd.  provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.

Ziitek D-U-N-S® Number: 656191068