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Rogers RT/duroid 6035 High Frequency PCB Built on 10mil Core With Immersion Gold for Filters

Categories High Frequency PCB
Brand Name: Bicheng Technologies Limited
Model Number: BIC-125-V01
Certification: UL
Place of Origin: China
MOQ: 1
Price: USD 9.99-99.99
Payment Terms: T/T, Western Union
Supply Ability: 50000 pieces per month
Delivery Time: 10 working days
Packaging Details: Vacuum
Number of Layers: 2
Glass Epoxy: RT/duroid 6035HTC
Final foil: 1.0 Oz
Final height of PCB: 0.3 mm ±10%
Surface Finish: Electroless nickel over Immersion Gold (ENIG)( 1 µ" over 100 µ" nickel)
Solder Mask Color: NO
Colour of Component Legend: NO
Test: 100% Electrical Test prior shipment
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Rogers RT/duroid 6035 High Frequency PCB Built on 10mil Core With Immersion Gold for Filters

Rogers RT/duroid 6035 High Frequency PCB Built on 10mil Core With Immersion Gold for Filters

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


RT/duroid 6035HTC high frequency circuit materials of Rogers Corporation are ceramic filled PTFE composites for use in high power RF and microwave applications. With a thermal conductivity of almost 2.4 times the standard RT/duroid 6000 products, and

copper foil (electrodeposited and reverse treat) with excellent long term thermal stability, RT/duroid 6035HTC laminates are an exceptional choice for high power applications.



Features/Benefits:

1. High Thermal conductivity

Improved dielectric heat dissipation enables lower operating temperatures for high power applications

  • Low loss tangent

Excellent high frequency performance

  • Thermally stable low profile and reverse treat copper foil

Lower insertion loss and excellent thermal stability of traces

  • Advanced filler system

Improved drill ability and extended tool life compared to alumina containing circuit materials



Some Typical Applications:

1. High Power RF and Microwave Amplifiers

2. Power amplifiers, Couplers, Filters

3. Combiners, Power Dividers


PCB Capability (RT/duroid 6035HTC)

PCB Material:Ceramic-filled PTFE composites
Designation:RT/duroid 6035HTC
Dielectric constant:3.50±0.05
Layer count:Double Layer, Multilayer, Hybrid PCB
Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Yellow, Red etc.
Surface finish:Bare copper, HASL, ENIG, OSP etc..

Data Sheet of RT/duroid 6035HTC

PropertyRT/duorid 6035HTCDirectionUnitsConditionTest Method
Dielectric Constant,εProcess3.50±0.05Z10 GHz/23℃IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign3.6Z8 GHz - 40 GHzDifferential Phase Length Method
Dissipation Factor0.0013Z10 GHz/23℃IPC-TM-650 2.5.5.5
Thermal Coefficient of ε-66Zppm/℃-50 ℃to 150℃mod IPC-TM-650, 2.5.5.5
Volume Resistivity108MΩ.cmAIPC-TM-650, 2.5.17.1
Surface Resistivity108AIPC-TM-650, 2.5.17.1
Dimensional Stability-0.11 -0.08CMD MDmm/m (mils/inch)0.030" 1oz EDC foil Thickness after etch '+E4/105IPC-TM-650 2.4.39A
Tensile Modulus329 244MD CMDkpsi40 hrs @23℃/50RHASTM D638
Moisure Absorption0.06%D24/23IPC-TM-650 2.6.2.1 ASTM D570
Coefficient of Thermal Expansion (-50 ℃to 288 ℃)19 19 39X Y Zppm/℃23℃ / 50% RHIPC-TM-650 2.4.41
Thermal Conductivity1.44W/m/k80℃ASTM C518
Density2.2gm/cm323℃ASTM D792
Copper Peel Stength7.9pli20 sec. @288 ℃IPC-TM-650 2.4.8
FlammabilityV-0UL 94
Lead-Free Process CompatibleYes

China Rogers RT/duroid 6035 High Frequency PCB Built on 10mil Core With Immersion Gold for Filters factory
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