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TMM4 High Frequency Printed Circuit Board 60mil 1.524mm Rogers RF PCB DK4.5 With Immersion Gold

Categories High Frequency PCB
Brand Name: Bicheng Technologies Limited
Model Number: BIC-105-V6
Certification: UL
Place of Origin: China
MOQ: 1
Price: USD 9.99-99.99
Payment Terms: T/T, Paypal
Supply Ability: 50000 pieces per month
Delivery Time: 10 working days
Packaging Details: Vacuum
Glass Epoxy: TMM4
Final height of PCB: 1.6 mm ±0.1mm
Final foil external:: 1oz
Surface Finish: ENIG
Solder Mask Color:: NO
Colour of Component Legend: NO
Number of Layers: 2 layers
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TMM4 High Frequency Printed Circuit Board 60mil 1.524mm Rogers RF PCB DK4.5 With Immersion Gold

TMM4 High Frequency Printed Circuit Board 60mil 1.524mm Rogers RF PCB DK4.5 With Immersion Gold

(PCB's are custom-made products, the picture and parameters shown are just for reference)


General Description

This is a type of double layer RF PCB which is made on Rogers TMM4 60mil substrate. There’s only 1 NPTH hole in the board with 0.5oz base copper plated to 1oz. The surface finish on pads is immersion gold and no solder mask or silkscreen printed. Track layer is on top and whole bottom layer is copper covered as shielding function. The boards are fabricated as per IPC Class II standard and 100% electrical tested before shipment. Every 25 board are vacuum packed for delivery.


PCB Specifications

PCB SIZE90 x 90mm=1up
BOARD TYPEDouble sided PCB
Number of Layers2 layers
Surface Mount ComponentsYES
Through Hole ComponentsNO
LAYER STACKUPcopper ------- 17um(0.5 oz)+plate TOP layer
TMM4 1.524mm
copper ------- 17um(0.5 oz) + plate BOT Layer
TECHNOLOGY
Minimum Trace and Space:100 mil / 100 mil
Minimum / Maximum Holes:1.5 mm / 1.5 mm
Number of Different Holes:1
Number of Drill Holes:1
Number of Milled Slots:0
Number of Internal Cutouts:0
Impedance Control:no
Number of Gold finger:0
BOARD MATERIAL
Glass Epoxy:TMM4 1.524mm
Final foil external:1.0 oz
Final foil internal:N/A
Final height of PCB:1.6 mm ±0.16
PLATING AND COATING
Surface FinishImmersion Gold, 89%
Solder Mask Apply To:N/A
Solder Mask Color:N/A
Solder Mask Type:LPI
CONTOUR/CUTTINGRouting
MARKING
Side of Component LegendN/A
Colour of Component LegendN/A
Manufacturer Name or Logo:N/A
VIAN/A
FLAMIBILITY RATING94V-0
DIMENSION TOLERANCE
Outline dimension:0.0059"
Board plating:0.0029"
Drill tolerance:0.002"
TEST100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIEDemail file, Gerber RS-274-X, PCBDOC etc
SERVICE AREAWorldwide, Globally.


Typical Applications:

1. Chip testers

2. Dielectric polarizers and lenses

3. Filters and coupler

4. Global Positioning Systems Antennas

5. Patch Antennas

6. Power amplifiers and combiners

7. RF and microwave circuitry

8. Satellite communication systems


Our Capability (TMM4)

PCB Material:Composite of Ceramic, hydrocarbon and thermoset polymer
Designator:TMM4
Dielectric constant:4.5 ±0.045 (process); 4.7 (design)
Layer count:1 Layer, 2 Layer
Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil (0.762mm), 50mil (1.270mm), 60mil (1.524mm), 75mil (1.905mm), 100mil (2.540mm), 125mil (3.175mm)
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Yellow, Red etc.
Surface finish:Bare copper, HASL, ENIG, Immersion tin, Pure gold (no nickle under gold), OSP.

Data Sheet of TMM4

PropertyTMM4DirectionUnitsConditionTest Method
Dielectric Constant,εProcess4.5±0.045Z10 GHzIPC-TM-650 2.5.5.5
Dielectric Constant,εDesign4.7--8GHz to 40 GHzDifferential Phase Length Method
Dissipation Factor (process)0.002Z-10 GHzIPC-TM-650 2.5.5.5
Thermal Coefficient of dielectric constant+15-ppm/°K-55-125IPC-TM-650 2.5.5.5
Insulation Resistance>2000-GohmC/96/60/95ASTM D257
Volume Resistivity6 x 108-Mohm.cm-ASTM D257
Surface Resistivity1 x 109-Mohm-ASTM D257
Electrical Strength(dielectric strength)371ZV/mil-IPC-TM-650 method 2.5.6.2
Thermal Properties
Decompositioin Temperature(Td)425425TGA-ASTM D3850
Coefficient of Thermal Expansion - x16Xppm/K0 to 140 ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Y16Yppm/K0 to 140 ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Z21Zppm/K0 to 140 ASTM E 831 IPC-TM-650, 2.4.41
Thermal Conductivity0.7ZW/m/K80 ASTM C518
Mechanical Properties
Copper Peel Strength after Thermal Stress5.7 (1.0)X,Ylb/inch (N/mm)after solder float 1 oz. EDCIPC-TM-650 Method 2.4.8
Flexural Strength (MD/CMD)15.91X,YkpsiAASTM D790
Flexural Modulus (MD/CMD)1.76X,YMpsiAASTM D790
Physical Properties
Moisture Absorption (2X2)1.27mm (0.050")0.07-%D/24/23ASTM D570
3.18mm (0.125")0.18
Specific Gravity2.07--AASTM D792
Specific Heat Capacity0.83-J/g/KACalculated
Lead-Free Process CompatibleYES----
China TMM4 High Frequency Printed Circuit Board 60mil 1.524mm Rogers RF PCB DK4.5 With Immersion Gold factory
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