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| Categories | Through Hole PCB Assembly | 
|---|---|
| Brand Name: | HUASWIN | 
| Model Number: | HSPCBA1023 | 
| Certification: | ISO/UL/RoHS | 
| Place of Origin: | China | 
| MOQ: | 1 sets | 
| Price: | Negotiation | 
| Payment Terms: | T/T, Western Union, L/C | 
| Supply Ability: | 10,000pcs per month | 
| Delivery Time: | 15-20 working days | 
| Packaging Details: | Anti-static bag + Anti-static bubble wrap + Good quality carton box | 
| Company Info. | 
| Huaswin Electronics Co.,Limited | 
| View Contact Details | 
| Product List | 
10 Layer FR4 Circuit Board Assembly / SMT and Through Hole PCB
Assembly
Specifications:
| Layer: 10 Layer | Mini Hole: 0.2mm | 
| Material: FR4 | Mini Width/space: 4mil/4mil | 
| Thickness: 2.0mm | Testing points:4000 | 
| Copper thickness: 1oz | Solder Mask: LPI Green | 
| Finish: Immersion Gold | Silkscreen: White | 
| Function: Controller | Components: 10 IC chips, 2 Crystals, 5 Transistors | 
Detailed Specification of PCB Manufacturing
1  | layer  | 1-30 layer  | 
2  | Material  | CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide,  | 
3  | Board thickness  | 0.2mm-6mm  | 
4  | Max.finished board size  | 800*508mm  | 
5  | Min.drilled hole size  | 0.25mm  | 
6  | min.line width  | 0.075mm(3mil)  | 
7  | min.line spacing  | 0.075mm(3mil)  | 
8  | Surface finish  | HAL, HAL Lead free,Immersion Gold/ Silver/Tin,  | 
9  | Copper thickness  | 0.5-4.0oz  | 
10  | Solder mask color  | green/black/white/red/blue/yellow  | 
11  | Inner packing  | Vacuum packing,Plastic bag  | 
12  | Outer packing  | standard carton packing  | 
13  | Hole tolerance  | PTH:±0.076,NTPH:±0.05  | 
14  | Certificate  | UL,ISO9001,ISO14001,ROHS,TS16949  | 
15  | Profiling punching  | Routing,V-CUT,Beveling  | 
Detailed Specification of Pcb Assembly
1  | Type of Assembly  | SMT and Thru-hole  | 
2  | Solder Type  | Water Soluble Solder Paste,Leaded and Lead-Free  | 
3  | Components  | Passives Down to 0201 Size  | 
BGA and VFBGA  | ||
Leadless Chip Carries/CSP  | ||
Double-Sided SMT Assembly  | ||
Fine Pitch to 08 Mils  | ||
BGA Repair and Reball  | ||
Part Removal and Replacement-Same Day Service  | ||
3  | Bare Board Size  | Smallest:0.25x0.25 Inches  | 
Largest:20x20 Inches  | ||
4  | File Formats  | Bill of Materials  | 
Gerber Files  | ||
Pick-N-Place File(XYRS)  | ||
5  | Type of Service  | Turn-Key,Partial Turn-Key or Consignment  | 
6  | Component Packaging  | Cut Tape  | 
Tube  | ||
Reels  | ||
Loose Parts  | ||
7  | Turn Time  | 15 to 20 days  | 
8  | Testing  | AOI inspection  | 
X-Ray inspection  | ||
In-Circuit testing  | ||
Functional test  | 
Quality Assurance:
Our Quality processes include:
1. IQC: Incoming Quality Control (Incoming Materials Inspection)
2. First Article Inspection for every process
3. IPQC: In Process Quality Control
4. QC: 100% Test & Inspection
5. QA: Quality Assurance based on QC inspection again
6. Workmanship: IPC-A-610, ESD
7. Quality Management based on CQC, ISO9001:2008, ISO 14001:2004
Certificates:
ISO9001-2008
ISO/TS16949
UL
IPC-A-600G and IPC-A-610E Class II compliance
Customer's requirements
                                 
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