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Custom SMT BGA PCB Printed Circuit Board Assembly AOI Testing

Categories Through Hole PCB Assembly
Brand Name: HUASWIN
Model Number: HSPCBA1046
Certification: ISO/UL/RoHS
Place of Origin: China
MOQ: 1 sets
Price: Negotiation
Payment Terms: T/T, Western Union, L/C
Supply Ability: 10,000pcs per month
Delivery Time: 15-20 working days
Packaging Details: Anti-static bag + Anti-static bubble wrap + Good quality carton box
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Custom SMT BGA PCB Printed Circuit Board Assembly AOI Testing


Custom SMT BGA PCB Printed Circuit Board Assembly AOI Testing


Specifications


1. PCB design & fabrication

2. Material Sourcing Service
3. SMD assembly and Through hole components insertion
4. IC pre-programming / Burning on-line
5. Function testing as requested
6. Complete Unit assembly ( which including plastics, metal box, Coil, cable inside etc)
7. Packing design


Our advanced equipment, process flows in SMT, DIP assembly and high Standard Operation Procedure (SOP) are the fundamental assurance of providing high quality assembly service. The excellent soldering skills to our experienced employee on the production line, and the comfortable clean working environment ensures the quality of our strong processing capacity.


All of our products are produced under strictly observation of the ISO9001: 2000 and conform to the ROHS standard. We always take customer's satisfaction as our principle pursuit, " Good quality with reasonable price", "Quick delivery".


PCB Assembly services:


SMT Assembly


Automatic Pick & Place
Component Placement as Small as 0201
Fine Pitch QEP - BGA
Automatic Optical Inspection

Through-hole Assembly


Wave Soldering
Hand Assembly and Soldering

Material Sourcing
IC pre-programming / Burning on-line

Function testing as requested

Aging test for LED and Power boards

Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc)
Packing design


Testing Methods

AOI Testing
Checks for solder paste
Checks for components down to 0201"
Checks for missing components, offset, incorrect parts, polarity

X-Ray Inspection
X-Ray provides high-resolution inspection of:
BGAs
Bare boards

In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by

component problems.
Power-up Test
Advanced Function Test
Flash Device Programming
Functional testing


Design file format:

1. Gerber RS-274X, 274D, Eagle and AutoCAD's DXF, DWG
2. BOM (bill of materials)
3. Pick and place file (XYRS)


Advantages:

1. Turnkey manufacturing or quick-turn prototypes
2. Board-level assembly or complete system integration
3. Low-volume or mixed-technology assembly for PCBA
4. Even consignment production
5. Supported capabilities

China Custom SMT BGA PCB Printed Circuit Board Assembly AOI Testing factory
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