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All wafer level packaging wholesalers & wafer level packaging manufacturers come from members. We doesn't provide wafer level packaging products or service, please contact them directly and verify their companies info carefully.
| Total 1704 products from wafer level packaging Manufactures & Suppliers |
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Brand Name:SensorMicro Place of Origin:Wuhan, Hubei Province, China Model Number:Apex612W ...Wafer Level Packaging (WLP) detector series, delivering exceptional thermal imaging performance for demanding applications. Wafer Level Packaging (WLP) technology enables high vacuum packaging directly on the entire MEMS wafer, followed by scribing and cutting to produce ... |
Wuhan SensorMicro Technology Co., Ltd
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Brand Name:Hiner-pack Model Number:HN24227 Place of Origin:China ...Wafer Level Packaging & Clean IC Protection Specialized JEDEC IC Trays perfectly fit semiconductor wafer level packaging production. They adapt well to high-standard cleanroom environments, and effectively reduce dust contamination to protect chip integrity. Ultra-low particle generation performance keeps inner working conditions clean. They maintain stable performance for IC components during whole wafer... |
Shenzhen Hiner Technology Co., Ltd.
Guangdong |
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Model Number:MXC4005XC Brand Name:Original Factory Place of Origin:CN MXC4005 Sensor IC Monolithic And Wafer Level Packaged Three-Axis Accelerometer WLP-6 Product Overview Of MXC4005 The MXC4005 is a monolithic and wafer level packaged three-axis accelerometer featuring the smallest profile of 1.18mm×1.70mm×0.85mm, making... |
ShenZhen Mingjiada Electronics Co.,Ltd.
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Brand Name:BeyondView Model Number:FW312 Place of Origin:Beijing ... microbolometer structure has optimal sensitivity to long wavelengths between 8 and 14µm. FW312 infrared detector uses wafer-level packaging technology to minimize size and weight while ensuring stability and reliability, achieving a more compact and |
Beijing BeyondView Technology Co., Ltd
Beijing |
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Brand Name:Mingseal Model Number:GS600SW Place of Origin:China ...Wafer-Level Underfill Dispenser is Mingseal’s flagship dispensing module designed for next-generation wafer-level packaging (WLP) and advanced redistribution layer (RDL) processes. Built to handle high-complexity underfill and flux spray operations, it is ideal for Fan-Out Wafer-Level Packaging... |
Changzhou Mingseal Robot Technology Co., Ltd.
Jiangsu |
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Brand Name:zmkj Model Number:dia3x0.12mmt Place of Origin:China ...wafer single tray is a container used to hold and protect a single 4-inch sapphire wafer during transport and storage. Here are some common specifications for a 4-inch sapphire wafer single tray: - Wafer size: 4 inches (100 mm) - Material: Polycarbonate or |
SHANGHAI FAMOUS TRADE CO.,LTD
Shanghai |
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Brand Name:Truth Instruments Model Number:Wafer-MOKE ... of hysteresis loop information including free layer and pinned layer Hc, Hex, and M (Kerr angle value), as well as rapid mapping of wafer magnetic characteristic distribution. With |
Truth Instruments Co., Ltd.
Shandong |
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Place of Origin:Shannxi,China Brand Name:Hoan Model Number:HACC-CUSTOM-GS Custom MOS Capacitor Pinhole Free Glassivation Passivation Wafer Level S Parameter Consistency Fine Capacitance Step HACC-CUSTOM-GS: Pinhole-Free Glassivation MOS Capacitor with Wafer-Level S-Parameter Consistency & Fine Capacitance Step Advanced Pinhole-... |
HongAn Microwave Co., Ltd.
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Brand Name:NSWprint Model Number:J36 Place of Origin:Guangzhou, China ...Wafer Biscuit Packaging Folding Mailer Box details: Product Name Food Grade Folding Mailer Carton Boxes Wafer Biscuit Packaging Size (L*W*H) Customized Shape Square / Rectangle/ Hexagon Color Customized Price Negotiable Material 350gsm coated paper Print 4c print Finishing Matte varnishing Brand OEM and ODM are available, and we can print your logo on the box Packaging... |
Guangzhou NSW printing co.,ltd
Guangdong |
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Brand Name:Sme Electromechanical PLC Drive Cleaning Machine Purification System 8200 Specifications Sufficient Supply Delivery Model Number:SME-8200 Place of Origin:china Product Description: The Semiconductor Cleaning Machine is an automatic cleaning device that is designed to effectively remove water-based flux and other types of contamination from various electronic components. Measuring 8250*1970*1770mm (L*W*H), this ... |
Dongguan Shenhua Mechanical and Electrical Equipment ...
Guangdong |
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Brand Name:skyiwnbake Model Number:two Place of Origin:gungdong , China Product Description High Speed Wafer Biscuit Automatic Packing Line wafer automatic feeding and packing line including separation conveyor ,distribution conveyor , pushing device, storage conveyor and automatic packing machine.Products are aligned fir... |
Skywin Foodstuff Machinery Co., Ltd.
Guangdong |
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Brand Name:JC Model Number:ETCH-012 Place of Origin:China A semiconductor quartz insert ring is a high-purity, precision-engineered ring made from fused quartz, crucial in semiconductor etching to guide etching gases, control plasma, and shield wafers from contamination, ensuring uniform etching, reduced defects... |
Nantong Jingcai Precision Co., Ltd.
Jiangsu |
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Brand Name:Waylead Model Number:WL-420 Place of Origin:Shanghai Product Description: Features: High Efficiency: Our bakery packing machine is able to pack 30-450 packs per minute, allowing for quick and efficient packaging of your products. Automatic Packaging: The machine operates automatically, reducing the need for ... |
Shanghai Waylead Intelligent Technology Co.,Ltd
Shanghai |
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Brand Name:onsemi Model Number:FDN340P Place of Origin:original FDN340P MOSFET Power Electronics Single P-Channel POWERTRENCH Logic Level Package SOT-23 Drain to Source Voltage (Vdss) 20 V Current - Continuous Drain (Id) @ 25°C 2A (Ta) Drive ... |
Shenzhen Sai Collie Technology Co., Ltd.
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Brand Name:Taichuan Model Number:TCZB-250,TCZB-320,TCZB-450 Place of Origin:Foshan , Guangdong, China Scourer packaging machine , Aborbent Cloth wrapping machine,Sponge packaging machine , foam packing machine Application: Horizontal pillow flow pack is suitable for :Food (Snack bar,bread,cookies,ice lolly,cake.chocolate,) Plastic(Cutlery,tray,) hardware(... |
TaiChuan Packaging Machinery Co.,Ltd
Guangdong |
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Model Number:ECH400V-MP Brand Name:GoGo Place of Origin:Suzhou, China The GoGo ECH400V-MP Multi-Probe Vacuum Probe Station redefines flexibility in electrical device characterization with a comprehensive 6-probe configuration. Where standard 4-probe stations limit measurement topologies, the ECH400V-MP enables simultaneous ... |
XihaoT (Suzhou) Technology Co., Ltd.
Jiangsu |
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Brand Name:BonTek Model Number:Fused Silica, Fused Quartz Place of Origin:China ...Wafer 4'' 6'' 8'' for MEMS Devices Glass wafers made of borosilicate glass are often used in Semiconductor and MEMS industry in a wide variety of applications. These wafers can be used for the encapsulation of MEMS devices for example for sensors using Wafer-Level-Packaging (WLP) technology or as blank glass substrates for semiconductor processing and optics. The borosilicate glass wafers... |
Hangzhou Freqcontrol Electronic Technology Ltd.
Shanghai |
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Brand Name:ZMSH Model Number:Silicon Carbide Wafer Place of Origin:China ... and thermal properties. It is a high-performance semiconductor that is ideal for a wide variety of applications. In addition to its high thermal resistance, it also features a very high level of hardness. Compared to other semiconductors, a |
SHANGHAI FAMOUS TRADE CO.,LTD
Shanghai |
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Brand Name:MICRO ACCURACY Model Number:SPC500 Place of Origin:china ... CSPS and so on. Features & Advantages of Wafer Inspecting microscope ■ High-precision marble base, table and column to ensure high stability and rigidity ■ Marble table design, with ... |
Leader Precision Instrument Co., Ltd
Guangdong |
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Brand Name:FUNSONIC Model Number:FS620 Place of Origin:CHINA ...Wafer Coating Description: Wafer coating is a unique process that facilitates the automatic application of chip bonding adhesives at the wafer level, followed by the formation of chip bonding films in the next stage. FUNSONIC's ultrasonic semiconductor wafer coating technology is suitable for wafer coating, which can achieve process speed, thickness control, and material uniformity. After the hot or UVB stage and wafer |
Hangzhou Qianrong Automation Equipment Co.,Ltd
Zhejiang |