csp mold

Brand Name:Horexs

Place of Origin:CHINA

... by stacking several thin Chip vertically on the thin substrate with previous CSP mounting technology. CSP (Chip Size Package) CSP is to attach Chip to the laminated substrate with wire-bonding and encapsulate it by using plastic-type molding compound ,

Brand Name:TJIN

Place of Origin:China

...sop, qfp, bga to csp to mcm, encapsulation form by the traditional single chip encapsulation to the multi-chip encapsulation form of change, encapsulation form of change, resulting in the encapsulation mold application technology continues to improve, the

Brand Name:SEEC

Model Number:CCM

Place of Origin:China

...CSP DUE CuAg Cu-Cr-Zr copper silver Nickel Sliver Packaging & Delivery Packaging Details Standard export seaworthy packing Copper Sheets For Sale (or by the customer's request). Delivery Time 30 days after received the advanced payment. Specifications Specifications: 1) Thickness: 0.15 - 8.0mm 2) Width: 10mm - 1000mm 3) Temper:O,1/4H,1/2H,H how to mold...

Brand Name:Hiner-pack

Model Number:HN24183

Place of Origin:SHENZHEN CHINA

...Molded Conductive Waffle Pack Chip Trays For Semiconductor Die Storage This foundational product in microelectronic packaging is a high-precision waffle pack chip tray engineered in the industry-standard 4-inch format. It is expertly designed to provide a secure and reliable environment for the storage, handling, and transportation of fragile semiconductor bare die and chip-scale packages (CSPs...

Brand Name:Unicomp

Model Number:AX9100vs

Place of Origin:China

Unicomp X-ray AX9100vs Multi-mode 3D Micro-focus X-ray Analyze Inspection System Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. ...