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All csp mold wholesalers & csp mold manufacturers come from members. We doesn't provide csp mold products or service, please contact them directly and verify their companies info carefully.
| Total 6 products from csp mold Manufactures & Suppliers |
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Brand Name:Horexs Place of Origin:CHINA ... by stacking several thin Chip vertically on the thin substrate with previous CSP mounting technology. CSP (Chip Size Package) CSP is to attach Chip to the laminated substrate with wire-bonding and encapsulate it by using plastic-type molding compound , |
HongRuiXing (Hubei) Electronics Co.,Ltd.
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Brand Name:TJIN Place of Origin:China ...sop, qfp, bga to csp to mcm, encapsulation form by the traditional single chip encapsulation to the multi-chip encapsulation form of change, encapsulation form of change, resulting in the encapsulation mold application technology continues to improve, the |
Guangdong Taijin Semiconductor Technology Co., Ltd
Guangdong |
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Brand Name:SEEC Model Number:CCM Place of Origin:China ...CSP DUE CuAg Cu-Cr-Zr copper silver Nickel Sliver Packaging & Delivery Packaging Details Standard export seaworthy packing Copper Sheets For Sale (or by the customer's request). Delivery Time 30 days after received the advanced payment. Specifications Specifications: 1) Thickness: 0.15 - 8.0mm 2) Width: 10mm - 1000mm 3) Temper:O,1/4H,1/2H,H how to mold... |
BEIJING SINO STEEL ENGINEERING & EQUIPMENT CO., LTD.
Beijing |
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Brand Name:Hiner-pack Model Number:HN24007 ...Mold Bare Die Tray With High Temperature Resistance Bare Die Trays, also known as waffle pack trays, are thin trays typically measuring 2 inches or 4 inches square. These trays feature a regular pattern of separator ribs that create pockets, giving them the appearance of a waffle. Waffle pack chip trays are mainly used for handling and transporting bare die or chip scale packages (CSP... |
Shenzhen Hiner Technology Co., Ltd.
Guangdong |
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Brand Name:FZX Fanout Process and Product Place of Origin:PR China Description: 310*320mm panel size; Package size: 2.0*2.0mm; Package thickness: 0.5mm; Chip size: 1.0*1.6mm; Process type: FOPLP (Face Up); Process introduction: After the chip is picked and placed onto the temporary carrier board, the packaging process is ... |
Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.
Guangdong |
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Brand Name:Unicomp Model Number:AX9100vs Place of Origin:China Unicomp X-ray AX9100vs Multi-mode 3D Micro-focus X-ray Analyze Inspection System Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. ... |
Unicomp Technology
Guangdong |