bga package microprocessor ic

Brand Name:Original Factory

Model Number:MIMX8QM6AVUFFAB

Place of Origin:CN

MIMX8QM6AVUFFAB ARM Cortex -A72 1.6GHz 1313-BGA Embedded Microprocessors IC Product Description Of MIMX8QM6AVUFFAB MIMX8QM6AVUFFAB supports a single 4K display (with multiple display output options, including MIPI-DSI, ...

Brand Name:Horexs

Model Number:HRX

Place of Origin:CHINA

Application:IC substrate package,Wifi module/Bluetooth module,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/...

Categories:IC Integrated Circuits

Country/Region:china

IC Integrated Circuits TUSB2E111YCGR BGA-15 Interface ICs Specifications Product Attribute Attribute Value Manufacturer: Texas Instruments Product Category: USB Interface IC RoHS: Details Series: TUSB2E111 Product: USB 2.0 Repeaters Mounting Style: PCB Mount Package / Case: BGA-15 Standard: USB 2.0 Supply Voltage - Min: 3 V Supply Voltage - Max: 3.6 V Minimum Operating Temperature: - 20 C Maximum Operating Temperature: + 85 C Packaging...

Brand Name:XILINX / AMD

Model Number:XC6SLX150-2FGG676I

Place of Origin:original

...IC Chip 676-BGA Package Embedded FPGAs Abundant Flexible Logic Resources Number of LABs/CLBs 11519 Number of Logic Elements/Cells 147443 Total RAM Bits 4939776 Number of I/O 498 Voltage - Supply 1.14V ~ 1.26V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 676-BGA Supplier Device Package...

Brand Name:SYMBIOS

Model Number:355-0026-220

Place of Origin:Malaysia

...ICs) 355-0026-220 SYMBIOS BGA Integrated Circuits Ic Components Specification :355-0026-220 Category Integrated Circuits (ICs) Product Name Electronic components Model number 355-0026-220 Mfr SYMBIOS Series IC Components Package Standard package Condition New and original Package Lead time In stock can be shipped ASAP Features - Package / Case BGA...

Brand Name:Silicon Motion, Inc.

Model Number:SM662PEF BFST

Place of Origin:Taiwan

...IC EMMC 153-BGA (11.5x13) Mfr Silicon Motion, Inc. Series Ferri-eMMC® Product Status Active Memory Type Non-Volatile Memory Format FLASH Technology FLASH - NAND (TLC) Memory Size - Memory Interface eMMC Write Cycle Time - Word, Page - Voltage - Supply - Operating Temperature -40°C ~ 85°C Mounting Type Surface Mount Package / Case 153-TFBGA Supplier Device Package 153-BGA...

Brand Name:C2MICRO TI

Model Number:CC1203F08SG7F-JHC1 CC1310F128RGZR CC1310F128RHBR

Place of Origin:Malaysia

...ICs) CC1203F08SG7F-JHC1 CC1310F128RGZR CC1310F128RHBR C2MICRO TI BGA VQFN48 VQFN32 IC Integrated Circuits Components Specification :CC1203F08SG7F-JHC1 CC1310F128RGZR CC1310F128RHBR Category Integrated Circuits (ICs) Product Name Electronic components Model number CC1203F08SG7F-JHC1 CC1310F128RGZR CC1310F128RHBR Mfr FAIRCHILD Series IC Components Package Standard package Condition New and original Package

Brand Name:PG

Place of Origin:Shenzhen, China

Model Number:G2864TLCA/ G28128TLCA/ G28256TLCA

... Card Endurable eMMC BGA 153 Flash IC Component Automotive-grade eMMC is an embedded non-volatile memory chip specifically engineered for the demanding environments of automotive electronics. Utilizing the BGA 153 package, this solution integrates NAND...

Brand Name:NX*

Place of Origin:China, GuangDong, ShenZhen

Model Number:MPC8548VJAVHD

... a current range of 1A, 2A and 3A, size options of 0.4mm, 0.5mm and 0.65mm, package/case options of QFP, BGA, TSSOP38, HTSSOP38 and TSOP48, power options of 1W, 2W and 3W, and voltage options of 3.3V, 5V and 12V. Our Electronic IC Chips can be used for

Place of Origin:Guangdong, China

Brand Name:Wisdomshow

...BGA rework machine WDS-720 mobile phone emmc ic repair tools for repairing shop Above is the professional mobile BGA REWORK STATION WDS-720 Product Description Hot selling BGA rework machine WDS-720 mobile phone emmc ic repair tools for repairing shop wds-720 Optical Automatic BGA Rework Station Feature Summary ∗WDS bga...

Brand Name:Jiaqing Circuit

Place of Origin:China

BT IC substrate product line is engineered for advanced package formats including FC-CSP (Flip Chip Chip Scale Package) and WB-BGA (Wire Bond Ball Grid Array). BT resin, with its high glass transition temperature (180-225°C), low moisture ...

Brand Name:Qualcomm

Model Number:CSR8645B04-IBBC-R

Place of Origin:USA

CSR8645B04-IBBC-R BGA Package Bluetooth Main Control Chip RF360 New Imported Original Spot Product Attribute Attribute Value Select Attribute ...

Brand Name:Maxim Original

Model Number:MAX705CSA+

Place of Origin:Original Factory

... required to monitor power-supply and battery functions in µP systems. These devices significantly improve system reliability and accuracy compared to separate ICs or discrete components. Feature 1) A reset output during power-up, power-down, and

Brand Name:Maxim Original

Model Number:MAX705CSA+

Place of Origin:Original Factory

... required to monitor power-supply and battery functions in µP systems. These devices significantly improve system reliability and accuracy compared to separate ICs or discrete components. Feature 1) A reset output during power-up, power-down, and

Brand Name:Hiner-pack

Model Number:HN23076

Place of Origin:shenzhen，China

.... They are also lightweight, with a weight range of 120~200g, making them easy to handle and transport. The JEDEC IC Trays are made from durable materials that can withstand frequent use and handling. They are an ideal solution for storing IC chips in a

Place of Origin:Malaysia

Brand Name:N/A

Model Number:MPC8260AZUPIBB

MPC8260AZUPIBB MPU Microcontrollers and Processors BGA Package TYPE DESCRIPTION Categories Integrated Circuits (ICs) Embedded - Microcontrollers Series MSP430™ FRAM Packaging Tape & Reel (TR) Part Status Active Core Processor MSP430 Core Size 16-Bit ...

Categories:BGA Assembly

Country/Region:china

...BGA Assembly Service - Integrated Solution for Precision Welding and X-ray Inspection ♦ What is BGA Assembly? BGA Assembly (Ball Grid Array Assembly) is a high-density packaging technology in which the chip is soldered directly to the PCB by means of an "array of miniature solder balls", like "planting" tiny solder balls on the bottom of the chip to achieve ultra-fine electrical connections.BGA...

Brand Name:UNICOMP

Model Number:AX9500

Place of Origin:China

... PCB and BGA analysis. This fully upgraded system performs CT detection on BGA, CSP, flip chips, LEDs, and other semiconductors, while also supporting SMT welding analysis with advanced 3D tomography CT scanning technology (...

Model Number:XC7K355T-2FFG901I

Place of Origin:Malaysia

Brand Name:KAIGENG

XC7K355T-2FFG901I BGA Electronic Components IC MCU Microcontroller Integrated Circuits XC7K355T-2FFG901I #detail_decorate_root .magic-0{border-bottom-style:solid;border-bottom-color:#53647a;font-...

Brand Name: USA Inc.

Model Number:MPC8309CVMAHFCA

Place of Origin:CHINA

MPC8309CVMAHFCA Microprocessor IC MPC83xx 1 Core, 32-Bit 417MHz 489-PBGA Description: The MPC8309 incorporates the e300c3 (MPC603e-based) core built on ...