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Multifunction X Ray Solder Analyzer

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multifunction x ray solder analyzer

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Multifunction x ray inspection system for void rate BGA solder analysis

Multifunction X-Ray Inspection System for BGA Solder Void Rate Analysis Product Advantages Oversized 530×530mm stage with 10KG load capacity 60° tiltable FPD maintains magnification without compromise Automatic navigation window with click-to-move table positioning Programmable inspection procedures for automated batch inspection Easy operation with minimal training requirement (2 hours) Working Principle X-ray......

SHENZHEN WEIMING PHOTOELECTRIC CO.,LTD.

Address: 5F,B3, Anda ElectronicsIndustrial Factory, HepingCommunity, Fuhai Street, BaoanDistrict, Shenzhen

Solder Joint Hidden Damage Detection LED Driver X-ray Inspection Equipment AX9100max Unicomp

AX9100MAX X-ray Inspection Equipment High-accuracy nondestructive detection system for analyzing electronic IC parts, bonding wires, and solder joint hidden damage in LED drivers and electronic components. System Overview This advanced X-ray inspection ......

Unicomp Technology

Address: Building A, Bangkai Science & Technology Industrial Park, No. 9 Bangkai Road, Hi-Tech Industrial Park, Guangming District, Shenzhen

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