eMMC IC Package Substrate PCB
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...IC package substrate pcb For eMMC IC assembly package substrate pcb, BGA ,Gold plating,0.2mm finished,FR4 material,green soldermask (support customized),Use for wearable electronics,UAV,house electronics,consumer electronics. Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,EMMC substrate,IC assembly,Storage IC......
HongRuiXing (Hubei) Electronics Co.,Ltd.
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2 Layers IC Package Substrate Palladium Gold COF Electric Annoyed Liquid Crystal Drive
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2 layers of COF,electric annoyed liquid crystal drive,IC Package Substrate,palladium gold,ic package,pcb production Product Description Product area: electric annoyed liquid crystal drive Number of layers: 2 layers of COF ......
Shenzhen Chaosheng Electronic Technology Co.,Ltd
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THGBMNG5D1LBAIL Memory IC Chip 4 GB eMMC Memory IC FBGA-153 Package
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...IC Chip 4 GB eMMC Memory IC FBGA-153 Package Product Description Of THGBMNG5D1LBAIL THGBMNG5D1LBAIL is 4 GB eMMC Memory IC,the package is FBGA-153. Specifications Of THGBMNG5D1LBAIL Package/Case: FBGA-153 Memory Size: 4 GB Minimum Operating Temperature: - 25 C Maximum Operating Temperature: + 85 C Moisture Sensitive: Yes Unit Weight: 5 g Other Electronic Components In Stock Part Number Package......
ShenZhen Mingjiada Electronics Co.,Ltd.
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NOR Flash Memory IC 1G 110ns S29GL01GS11DHIV20 FBGA-64 Package
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S29GL01GS11DHIV20 Infineon 1G 3V 110ns Parallel NOR Flash FBGA-64 Manufacturer: Infineon Product Type: NOR Flash Installation style: SMD/SMT Package / Box: FBGA-64 Series: S29GL01G/512/256/128S Storage capacity: 1 Gbit Supply Voltage - Min: 2.7 V Supply ......
Eastern Stor International Ltd.
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Customized JEDEC Matrix Trays Loading FBGA IC ESD Rohs Raw Material
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Customized JEDEC Matrix Trays Loading FBGA IC ESD Rohs Raw Material Protect your ICs from electrostatic discharge and mechanical stress with JEDEC-compatible trays built for cleanroom and factory use. Hiner-pack offers the ultimate ......
Shenzhen Hiner Technology Co., Ltd.
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IC Substrate Multilayer Rigid PCB for Mobile Phone EMMC Package Substrate
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Product Images About TECircuit Found: TECircuit has been operating since 2004. Location: An electronics manufacturing service(EMS) provider located in Shenzhen China. Item: Customizable EMS PCB, offers a full range of one-stop shop services. Service: ......
Shenzhen Tecircuit Electronics Limited
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Precision Packaging Substrate 25-Micron Gloss BOPP Dual-Adhesive Coating Film in 3600mm Jumbo-Roll for Moisture-Proof
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... Coating Film Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Item 25-Micron High-Gloss BOPP Thermally Reactive Dual-Adhesive Coating Film Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Width 360-1920mm or custom Length 200-3600m or ......
NEWFLM(GUANGDONG)TECHNOLOGY CO.,LTD
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ADP1613ARMZ-R7 Power Management ICs Boost SEPIC Switching Regulator IC Package 8-TSSOP 8-MSOP63
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ADP1613ARMZ-R7 Power Management ICs Boost SEPIC Switching Regulator IC Package 8-TSSOP 8-MSOP Product Status Active Function Step-Up Output Configuration Positive Topology Boost, SEPIC Output Type ......
Shenzhen Sai Collie Technology Co., Ltd.
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IC Packaging Parts Inline Cleaning System With Trial Chemical Wash Sections
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...a IC packaging parts auto cleaning system with trial chemical wash sections. SC830 is a high wash ability FC packaging deflux cleaning system. 810 IC packaging auto cleaing machine is used to clean flux residuals, soder balls and particles on FC package ......
Dongguan Shenhua Mechanical and Electrical Equipment ...
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Custom Silver Bonding Wire With Composite Material Treatment For IC Packaging
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...game - changer in the field of high - reliability IC packaging. Made of high - purity silver, this bonding wire offers excellent electrical conductivity, ensuring efficient signal transmission in ICs. The composite material treatment further enhances its...
SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.
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