Rectangular Mirror Polished DIP4 MGP Mould For Semicon Processing
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DIP4 MGP Mold Technical Parameters 1. The roughness of the cavity can achieve 0.2um.max; 2. Special products can increase the design of vacuum and built -in core pumping mechanisms; 3. According to the size of different lead frames, 8 tablets/12 pieces/16 tablets per mold can be achieved. Technical Parameters: MGP Mold Technical Parameters Product Name High-Precision MGP Mold Application Semiconductor MGP Mold......
Guangdong Taijin Semiconductor Technology Co., Ltd
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dc input photo transistor coupler MIRACLE POWER MPC817C1-FGV with high isolation and dip4 package
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... diode with a silicon planar phototransistor detector in a plastic DIP4 package. Featuring a robust coplanar double mold structure, the MPC817 series offers stable isolation with a high rating of 5000 VRMS. They are suitable for use in switch mode power...
Beijing Silk Road Enterprise Management Services Co., Ltd.
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