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| Categories | Quick Turn PCB Assembly |
|---|---|
| Functional Application: | Circuit Protection |
| Application: | Electronics Device |
| Solder mask color: | Blue.green.red.black.white.etc |
| Supplier Type: | original manufacturer |
| Layer: | 1-40 Layers |
| Testing Service: | AOI testing, 100% ET testing,100% FQC |
| MOQ: | 10 |
| Certificate: | ISO9001/CE/RoHS/ISO 13485/TATF 16949 |
| Product name: | PCBA Assembly Manufacturer |
| Other Service: | Box Build Assembly |
| Type: | pcba |
| PCBA Service: | SMT, DIP, Through Hole |
| Quality: | Reliable |
| Brand Name: | TECOO |
| Model Number: | OEM Electronics Manufacturing |
| Place of Origin: | Zhejiang, China |
| Price: | €1.09-6.13 |
| Copper Thickness: | 0.5~4oz |
| Package: | Anti-static Bubble Bag |
| Standard: | IPC-A-610G |
| Company Info. |
| Shenzhen Haitian Feng Technology Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |





SMT Assembly Line | 8 Lines |
Capacity | 48.2 Million Placements Per Month |
Component Board | Max:550*450MM Min:50MM*50MM |
Speed | 0.15sec/chip 0.7sec/QFP |
Wave- Solder | Max. PCB width: 550MM*450 MM;Min:50MM*50MM |
Component height: Top 120 mm/Bot 15 mm | |
DIP Capacity | 420 square meters per hour |
Plug-in Equipment | PTH (Printed Through Hole) Machine. Non-standard Surface Mount
Technology (SMT) Machine |
Components | Passives Down to 0201 Size BGA and VFBGA Leadless Chip Carrier/CSP
Double- Sided SMT Assembly Fine Pitch to 08 Mil BGA Repair and
ReballPart Removal and Replacement-Same Day Service |
Test Equipment | FAI, X-RAY, SPI, ICT, FCT, AOI, 3D AOI, Burn-in, High-temperature
Load... |
Box Build | Box Build Integration and Assembly |
Quotation Document | Bill of Materials, Gerber Files, Pick-N-Place File(XYRS) |
Quantity | No MOQ, Prototype PCB Assembly & Small Batch PCB Assembly &
Wholesale PCBAS |
Certificate | ISO9001:2015/CE/RoHS/ISO 13485/TATF 16949 |
Environmentally Friendly | We are committed to environmental sustainability and use lead-free,
RoHS-compliant materials. |











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