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TE Connectivity 2-2013311-1

Categories Memory Connectors
Brand Name: TE Connectivity
Description: Through Hole Inline Module Sockets RoHS
Packaging Details: Through Hole
Model Number: 2-2013311-1
MOQ: 9000
Delivery Time: 25-42 weeks
Stock: 900000
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TE Connectivity 2-2013311-1

Product Overview

This product appears to be a connector or socket, likely for memory modules (e.g., DDR3 SODIMM). It features a mechanical key for proper orientation and a latch mechanism for secure mating. The product is designed for PCB mounting and is constructed from high-temperature thermoplastic with copper alloy contacts and stainless steel lock levers.

Brand TE Connectivity
Material - Housing High Temperature Thermo Plastic UL94V-0
Material - Contact Copper Alloy
Material - Lock Lever Stainless Steel
Material - Peg Copper Alloy
Certifications UL94V-0
Package Type Tape & Reel (for automated assembly)
Part NumberPitchHeightTypeContact Finish (Area)Contact Finish (Soldering Area)Peg FinishCoplanarity (Max)PCB Thickness
DDR3 SODIMM Socket0.6 mm9.2 mmReverse TypeGold Flash (0.000254 mm min) over NickelGold Flash PlatingTin Plating0.1 mm (Before Soldering)3.8 mm
DDR3 SODIMM Socket0.6 mm9.2 mmReverse Type0.00076 mm Gold over NickelGold Flash PlatingTin Plating0.1 mm (Before Soldering)3.8 mm
DDR3 SODIMM Socket0.6 mm9.2 mmReverse Type0.007 mm Gold over NickelGold Flash PlatingTin Plating0.1 mm (Before Soldering)3.8 mm
Pad FinishChamfer (Max)Component Area (Front Side)Component Area (Back Side)Mechanical Key Center Line
Gold Plating 0.00076 min. Over Ni Plating 0.002min0.25 x 4521.5 mm25.1 mm35 mm
China TE Connectivity 2-2013311-1 factory
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