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| Categories | Server PCB |
|---|---|
| Model Number: | XSWPCB |
| Material: | FR4 TG150 |
| MOQ: | 1 |
| Delivery Time: | 8-15DAYS |
| Surface Finish: | ENIG |
| Payment Terms: | Western Union |
| Certification: | UL ,IOS9000 |
| Board Thickness: | 1.6 mm (Customizable) |
| Place of Origin: | China |
| Copper Thickness: | 1/1/1/1/1/1 oz |
| Supply Ability: | 1 Million Square feet/per month |
| Price: | Negotiable |
| Brand Name: | XSW PCB |
| Layer Count: | 6L |
| Company Info. |
| Shenzhen Xunsiwei Circuit Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
The ENIG Multilayer PCB Board for Network Server is a high-density interconnect (HDI) PCB solution designed for servers, data centers, cloud computing platforms, storage systems, and advanced networking equipment. Featuring a multilayer HDI structure and premium ENIG (Electroless Nickel Immersion Gold) surface finish, this PCB delivers exceptional signal integrity, high routing density, and superior reliability for high-speed digital applications.
Engineered to support modern server architectures, the HDI PCB utilizes fine-line circuitry, microvias, blind vias, and buried vias to maximize circuit density while minimizing board size. The ENIG surface finish provides excellent solderability, flatness, and corrosion resistance, making it ideal for BGA, CSP, and other fine-pitch components commonly used in server and networking hardware.
| Layer Count | 6-Layer |
| Material | FR4 TG150 |
| Board Thickness | 1.6 mm (Customizable) |
| Copper Thickness | 1/1/1/1/1/1 oz |
| Minimum Hole Size | 0.25 mm |
| Minimum Line Width | 0.1 mm |
| Minimum Line Spacing | 0.1 mm |
| Solder Mask Color | Green |
| Surface Finish | ENIG |
Product Description
| Item | Mass Production Capability | Extreme Capability |
|---|---|---|
| Board Thickness Range | 0.3~6.0mm | 0.3~6.0mm |
| Exposure Alignment Accuracy | ±0.015mm | ±0.005mm |
| Minimum Annular Ring | Single side ≥0.05mm | Single side ≥0.05mm |
| Min Line Width/Space (1/3oz base copper) | 0.05mm / 0.05mm | 0.045mm / 0.045mm |
| Min Line Width/Space (1/2oz base copper) | 0.05mm / 0.05mm | 0.05mm / 0.05mm |
| Min Line Width/Space (1oz base copper) | 0.075mm / 0.075mm | 0.075mm / 0.075mm |
| Etching Tolerance (1/3oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1/2oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1oz base copper) | ±0.0075mm | ±0.0075mm |
| Gold Finger Total Pitch Tolerance | <30mm: ±0.05mm 30~60mm: ±0.075mm | <30mm: ±0.03mm 30~60mm: ±0.05mm |
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