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4 Layer Immersion Gold Multi PCB Circuit Boards For Communication Handsets

Categories Communication PCB
Place of Origin: China
Material: FR4 TG170
Minimum Hole Size: 0.2 mm
Payment Terms: Western Union
Price: Negotiable
Board Thickness: 1.2 mm
Model Number: XSWPCB
Copper Thickness: 1/1/1/1 oz
Brand Name: XSW PCB
Minimum Line Spacing: 0.1 mm
Supply Ability: 1 Million Square feet/per month
MOQ: 1
Minimum Line Width: 0.1 mm
Layer Count: 4
Certification: UL ,IOS9000
Delivery Time: 8-15DAYS
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4 Layer Immersion Gold Multi PCB Circuit Boards For Communication Handsets

4-Layer PCB Motherboard for Mobile Communication Devices

This product is specifically designed for communication mobile phones, aiming to provide a stable and reliable user experience as well as efficient application solutions.

Key Specifications
Layer Count4
MaterialFR4 TG170
Board Thickness1.2 mm
Copper Thickness1/1/1/1 oz
Minimum Hole Size0.2 mm
Minimum Line Width0.1 mm
Minimum Line Spacing0.1 mm
Solder Mask ColorGreen
Surface FinishENIG (Electroless Nickel Immersion Gold)
Application FieldMobile phone communication
Product Features
  • 4-Layer Precision Impedance Design ensures optimized and stable signal transmission
  • All buttons adopt ENIG (Immersion Gold) process for improved sensitivity and durability
  • Comprehensive Quality Control System covering various rigorous inspections and electrical functional testing
  • Communication-Grade Design guarantees smooth and stable daily use
  • PCB Solutions tailored specifically for the communication handset sector

We provide one-stop PCB solutions for the communication field, integrating material grading, precision manufacturing, full-process inspection, and environmental adaptability to meet long-term stable operation requirements.

Advantages of Custom PCB Solutions
  • Highly Customizable: Supports customization of dimensions, thickness, layer count, and various functional requirements to flexibly meet diverse application needs
  • High-Performance Materials: Utilizes FR-4 and medium-to-high TG materials, offering excellent heat resistance, moisture resistance, and long-term stability
  • Superior Reliability: Features high dielectric strength, robust voltage withstand capability, and excellent anti-interference performance, ensuring stable operation even in harsh environments
  • Professional Surface Finishes: Provides options such as ENIG, lead-free HASL, and OSP to ensure excellent solderability and long-term reliability
Technical Specifications
ItemMass Production CapabilityExtreme Capability
Board Thickness Range0.3~6.0mm0.3~6.0mm
Exposure Alignment Accuracy±0.015mm±0.005mm
Minimum Annular RingSingle side ≥0.05mmSingle side ≥0.05mm
Min Line Width/Space (1/3oz base copper)0.05mm / 0.05mm0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper)0.05mm / 0.05mm0.05mm / 0.05mm
Min Line Width/Space (1oz base copper)0.075mm / 0.075mm0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper)±0.005mm±0.005mm
Etching Tolerance (1/2oz base copper)±0.005mm±0.005mm
Etching Tolerance (1oz base copper)±0.0075mm±0.0075mm
Gold Finger Total Pitch Tolerance<30mm: ±0.05mm
30~60mm: ±0.075mm
<30mm: ±0.03mm
30~60mm: ±0.05mm
China 4 Layer Immersion Gold Multi PCB Circuit Boards For Communication Handsets factory
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