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Custom 6 Layer ENIG PCB For 5G Optical Modules With High Precision Registration

Categories 5G Optical Module PCB
Model Number: XSWPCB
Material: FR4 TG170
MOQ: 1
Delivery Time: 8-15DAYS
Surface Finish: ENIG
Payment Terms: Western Union
Supply Ability: 1 Million Square feet/per month
Certification: UL ,IOS9000
Board Thickness: 1.0 mm (Customizable)
Place of Origin: China
Copper Thickness: 1/1/1/1/1/1 oz
Price: Negotiable
Brand Name: XSW PCB
Layer Count: 6-Layer
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Custom 6 Layer ENIG PCB For 5G Optical Modules With High Precision Registration

6-Layer ENIG PCB for 5G Optical Modules with High-Precision Registration


5G optical module 6-layer through-hole immersion gold and green solder mask board, with controlled interlayer misalignment and immersion gold layer stress. Interlayer misalignment ≤50μm, X-ray sampling inspection, warpage ≤0.3%. Drill burrs ≤5μm, hole wall roughness ≤12μm, backlight ≥9 level. Plasma cleaning before immersion gold, gold thickness 0.05-0.10μm, nickel layer phosphorus content 8-11%, internal stress controlled at 80-100MPa. After green solder mask development, side etching ≤4μm, post-curing at 150℃×65min, insulation resistance ≥100MΩ. After thermal stress at 288℃×10s×3 times, through-hole copper elongation ≥12%, green solder mask no bubbling. Ion contamination ≤0.3μg/cm², CAF testing 1000h for each batch. 5G optical module-specific UL code is engraved on the board edge.


Key Specifications
Layer Count6-Layer
MaterialFR-4 TG170
Board Thickness1.0 mm (Customizable)
Copper Thickness1/1/1/1/1/1 oz
Minimum Hole Size0.1 mm
Minimum Line Width0.1 mm
Minimum Line Spacing0.1 mm
Solder Mask ColorGreen
Surface FinishENIG

Product Description

  • Designed for 5G Optical Communication Modules
    • Optimized for high-speed optical transceivers, optical network equipment, data center communication systems, and telecom infrastructure.
    • Supports stable high-frequency signal transmission and long-term operational reliability.
  • High-Precision 6-Layer PCB Construction
    • Interlayer registration controlled to ≤50μm for accurate multilayer alignment.
    • X-ray sampling inspection ensures consistent manufacturing quality.
    • Board warpage maintained at ≤0.3%, improving assembly accuracy and component reliability.
  • Superior Drilling Quality
    • Drill burrs controlled to ≤5μm for clean hole edges.
    • Hole wall roughness maintained at ≤12μm, enhancing copper plating adhesion.
    • Backlight inspection rating reaches ≥9, ensuring excellent through-hole quality.
  • Premium ENIG Surface Finish
    • Plasma cleaning process performed before immersion gold plating to improve coating adhesion and surface cleanliness.
    • Gold thickness controlled at 0.05–0.10μm for excellent solderability and contact performance.
    • Nickel layer phosphorus content maintained at 8–11%, ensuring stable metallurgical properties.
  • Design Specifications
ItemMass Production CapabilityExtreme Capability
Board Thickness Range0.3~6.0mm0.3~6.0mm
Exposure Alignment Accuracy±0.015mm±0.005mm
Minimum Annular RingSingle side ≥0.05mmSingle side ≥0.05mm
Min Line Width/Space (1/3oz base copper)0.05mm / 0.05mm0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper)0.05mm / 0.05mm0.05mm / 0.05mm
Min Line Width/Space (1oz base copper)0.075mm / 0.075mm0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper)±0.005mm±0.005mm
Etching Tolerance (1/2oz base copper)±0.005mm±0.005mm
Etching Tolerance (1oz base copper)±0.0075mm±0.0075mm
Gold Finger Total Pitch Tolerance<30mm: ±0.05mm
30~60mm: ±0.075mm
<30mm: ±0.03mm
30~60mm: ±0.05mm
Product Tags:

6 Layer ENIG PCB

  

Custom ENIG PCB

  
China Custom 6 Layer ENIG PCB For 5G Optical Modules With High Precision Registration factory
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