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| Categories | Turnkey PCBA |
|---|---|
| Price: | Quote based on your specs |
| Delivery Time: | 5-25 working days(varies by product) |
| Packaging Details: | ESD Protective Packaging |
| MOQ: | No MOQ |
| Place of Origin: | China |
| Payment Terms: | T/T |
| Supply Ability: | 100,000 pieces/month |
| Company Info. |
| Studio Technology Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
Modern electronics design pushes the limits of manufacturing capability. High-density interconnects, micro-BGA packages, fine-pitch components, and complex mixed-technology boards require precision placement and advanced inspection that standard SMT lines cannot provide. At Studio, we specialize in these demanding assemblies. Our Advanced SMT Turnkey PCBA with BGA & Fine-Pitch Support delivers precision manufacturing for the most complex PCB designs.
Our advanced SMT capability is powered by 12 fully automated SMT production lines equipped with high-precision placement machines. We support 01005 components, micro-BGA (0.3mm pitch), QFN, LGA, and fine-pitch devices with exceptional accuracy. Automated wave soldering, programmable robotic soldering, and comprehensive inspection equipment—AOI, SPI, 3D X-Ray, ICT, FCT, flying probe testers, and an accredited reliability laboratory—ensure every board meets the highest quality standards.
| Component Type | Capability | Application |
|---|---|---|
| 01005 Components | Ultra-small passives (0.4mm × 0.2mm) | Miniaturized designs, wearables, mobile devices |
| Micro-BGA | 0.3mm pitch and below | High-density ICs, processors, memory |
| BGA (Ball Grid Array) | Full X-Ray inspection for hidden joints | Processors, FPGAs, ASIC |
| QFN (Quad Flat No-Lead) | Precision placement and thermal pad soldering | Power ICs, RF modules, sensors |
| LGA (Land Grid Array) | Surface mount with array of pads | Processors, high-density modules |
| Fine-Pitch QFP | 0.4mm/0.5mm lead pitch | Controllers, interface ICs |
| CSP (Chip Scale Package) | Near-die-size packaging | Memory, sensors, compact ICs |
| 0201 Components | Standard small passives | General high-density designs |
| Soldering Process | Application | Key Feature |
|---|---|---|
| Automated Reflow Soldering | SMT components with optimized thermal profiles | Multi-zone ovens with precise temperature control |
| Automated Wave Soldering | Through-hole components on mixed-technology boards | Programmable profiles, lead-free and leaded options |
| Selective Soldering | Through-hole components on SMT-dense boards | Precision nozzle positioning, minimal thermal stress |
| Robotic Soldering | Complex assemblies, component-level rework | Programmable, consistent, high-precision joints |
| Vapor Phase Reflow | Sensitive or complex assemblies | Even heating, oxygen-free environment |
Advanced SMT components require advanced inspection methods:
| Inspection Method | Purpose | Why It Matters |
|---|---|---|
| SPI (Solder Paste Inspection) | 3D measurement of paste volume, height, area | Prevents insufficient or excessive solder paste |
| AOI (Automated Optical Inspection) | Visual inspection of placement and joints | Identifies misalignment, polarity, and bridging |
| 3D X-Ray Inspection | Hidden-joint inspection for BGA, QFN, LGA | Detects voids, head-in-pillow, and insufficient wetting |
| ICT (In-Circuit Test) | Component-level electrical validation | Confirms each component is correctly connected |
| Flying Probe Test | Fixture-less electrical testing | Cost-effective for complex, high-mix boards |
| FCT (Functional Circuit Test) | Power-on verification of board function | Confirms board operates as designed |
Complex, high-density designs require a manufacturing partner with advanced SMT capability and precision quality systems. With Studio's Advanced SMT Turnkey PCBA with BGA & Fine-Pitch Support, you get the precision, inspection capability, and engineering expertise to bring your most demanding designs to life. Contact us today to discuss your advanced SMT project requirements.
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