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Stable High Leveling Acid Copper Plating Additives With High Impurity Tolerance

Categories Copper Plating Additives
Model Number: R·G-910
Copper Sulfate Pentahydrate: 160-210 g/L
Payment Terms: T/T
Operating Temperature: 20-30 ℃
MOQ: 25-30kg
Chloride Ion: 60-120 mg/L (ppm)
Packaging Details: 25kg/drum
Delivery Time: 5-8 work day
Cathode Current Density: 1-8 A/dm²
Place of Origin: China
Pure Sulfuric Acid: 50-70 g/L
Brand Name: AOBANG
Leveling power: 95%
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Stable High Leveling Acid Copper Plating Additives With High Impurity Tolerance

R·G-910 High Leveling Acid Copper Plating Additive
Performance & Features
  1. Innovative ultra-high concentrated composite formula with leveling power up to 95%.
  2. Easy bath control; coatings free of pinholes, low internal stress and ultra-high ductility.
  3. Extremely stable plating solution, crystal clear bright surface without fogging.
  4. High impurity tolerance and long bath service life.
Operating Parameters
ItemConcentration Range
Copper Sulfate Pentahydrate (CuSO₄·5H₂O)160–210 g/L
Pure Sulfuric Acid (Specific gravity=1.84)50–70 g/L
Chloride Ion60–120 mg/L (ppm)
R·G-910 MU Make-up Agent4–10 mL/L
R·G-910 A Primary Brightener0.4–0.8 mL/L
R·G-910 B Primary Brightener0.3–0.5 mL/L
Operating Temperature20–30 ℃
Cathode Current Density1–8 A/dm²
Anode Current Density0.5–3.0 A/dm²
Anode MaterialPhosphor copper balls (0.03–0.06% P)
AgitationAir agitation or mechanical agitation
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