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WL-CT615 High-Performance Thermoset Hydrocarbon/Ceramic Laminate & Custom 2-Layer PCB Solution
Introduction to WL-CT615
WL-CT615 is a high-performance thermosetting resin-based high-frequency laminate manufactured by Taizhou Wangling Insulation Material Factory. It belongs to the WL-CT series of organic polymer ceramic fiberglass cloth copper-clad laminates. The dielectric layer is composed of hydrocarbon resin, ceramic fillers, and fiberglass cloth reinforcement, providing excellent low-loss performance while maintaining exceptional PCB processability.
One of the key advantages of WL-CT615 is its FR4-compatible processing. Unlike PTFE-based materials that require specialized handling, WL-CT615 can be processed using standard FR4 manufacturing techniques, offering superior circuit stability and consistency while significantly simplifying the fabrication process. This makes it an ideal replacement for similar foreign products.
The hydrocarbon resin and composite ceramic system delivers outstanding low dielectric loss, high-temperature resistance, and excellent temperature stability. The material features a high Tg exceeding 280°C, ensuring dimensional stability and reliable plated-through-hole quality even under elevated temperatures.
The WL-CT series offers a wide range of dielectric constants, including 3.00, 3.30, 3.38, 3.48, 4.10, and 6.15, providing design flexibility across various applications.
Copper Foil Options
| Copper Foil Type | Key Characteristics |
| ED Copper | Standard electrodeposited copper; compatible with all WL-CT models |
| RTF Copper | Reverse-treated foil with adhesive backing; improves peel strength; not available for WL-CT615 |
Note: WL-CT615 is limited to ED copper foil only. Other WL-CT models can be supplied with either ED or RTF copper.
Key Technical Specifications (WL-CT615)
| Property | Test Condition | Unit | WL-CT615 Value |
| Dielectric Constant (Typical) @ 10 GHz | 10 GHz | — | 6.15 |
| Dielectric Constant (Design) @ 10 GHz | 10 GHz, 50Ω Microstrip | — | 6.4 |
| Dielectric Constant Tolerance | — | — | ±0.15 |
| Dissipation Factor @ 2 GHz | 2 GHz | — | 0.0032 |
| Dissipation Factor @ 10 GHz | 10 GHz | — | 0.004 |
| Thermal Coefficient of Dk | -55°C to +150°C | ppm/°C | -122 |
| Peel Strength (1 oz ED Copper) | 1 oz, Normal State | N/mm | 0.9 |
| Volume Resistivity | Normal State | MΩ·cm | 2×10⁷ |
| Surface Resistivity | Normal State | MΩ | 5×10⁶ |
| Electrical Strength (Z-direction) | 5 kV, 500 V/s | kV/mm | 30 |
| Breakdown Voltage (XY-direction) | 5 kV, 500 V/s | kV | 25 |
| CTE – X axis | -55°C to +288°C | ppm/°C | 15 |
| CTE – Y axis | -55°C to +288°C | ppm/°C | 17 |
| CTE – Z axis | -55°C to +288°C | ppm/°C | 33 |
| Thermal Stress | 288°C, 10s, 3 cycles | — | No Delamination |
| Moisture Absorption | 23.5±2°C, 24 hours | % | 0.08 |
| Density | Room Temperature | g/cm³ | 2.18 |
| Long-Term Operating Temperature | — | °C | -55 to +260 |
| Thermal Conductivity (Z-direction) | — | W/(m·K) | 0.72 |
| Flammability | — | UL-94 | V-0 |
| Tg (Glass Transition Temperature) | — | °C | >280 |
| Td (Decomposition Temperature) | Onset | °C | 398 |
| Halogen Content | — | — | Halogen-Free |
| Material Composition | — | — | Hydrocarbon + Ceramic + Fiberglass |
Features & Benefits
WL-CT615 delivers a comprehensive set of advantages for high-frequency and high-reliability applications:
| Feature | Description |
| High Dielectric Constant (6.15) | Enables circuit miniaturization and reduced wavelength for compact designs |
| Tight Dk Tolerance (±0.15) | Excellent batch-to-batch consistency for reliable performance |
| Low Dissipation Factor | 0.0040 @ 10 GHz – suitable for high-frequency signal integrity |
| High Tg (>280°C) | Maintains dimensional stability and PTH reliability at elevated temperatures |
| Copper-Matched CTE (15/17 ppm/°C) | Matches copper expansion for reliable plated-through holes |
| High Thermal Conductivity (0.72 W/m·K) | Superior to thermoplastic alternatives; supports high-power applications |
| Radiation Resistance | Maintains stable dielectric and physical properties after radiation exposure |
| Low Outgassing | Meets aerospace vacuum outgassing requirements |
| Halogen-Free | Environmentally friendly |
| UL 94 V-0 Flammability | Meets stringent safety requirements |
FR4-Compatible Processing: Can be fabricated using standard FR4 manufacturing techniques – no specialized processing required, unlike PTFE materials. This simplifies production, reduces costs, and improves circuit consistency.
Superior Thermal Stability: With high Tg (>280°C) and low TCDk (-122 ppm/°C), WL-CT615 maintains stable electrical performance across a wide temperature range.
High PTH Reliability: Low Z-axis CTE (33 ppm/°C) combined with copper-matched XY CTE ensures reliable plated-through-hole integrity under thermal cycling.
Excellent Thermal Management: Thermal conductivity of 0.72 W/(m·K) – exceeding typical thermoplastic materials – enables efficient heat dissipation in power applications.
Radiation Resistance & Low Outgassing: Suitable for aerospace, spaceborne, and defense applications requiring exceptional reliability.
Versatile Design Options: Available in multiple Dk values and compatible with aluminum base plates for shielding and heat dissipation.
Cost-Effective: Commercial-grade, high-volume production with excellent price-to-performance ratio.
Custom 2-Layer PCB Solution on WL-CT615
Leveraging the advanced properties of WL-CT615, we offer the following precision-engineered 2-layer rigid PCB solution. This design is ideal for high-frequency applications requiring excellent thermal stability, FR4-compatible processing, and reliable electrical performance.
PCB Construction Details
| Parameter | Specification |
| Base Material | Wangling WL-CT615 (ED Copper) |
| Number of Layers | 2 |
| Finished Board Size | 99.03 mm × 45.6 mm (±0.15 mm) |
| Finished Board Thickness | 0.3 mm |
| Minimum Trace / Space | 4 / 5 mils |
| Minimum Hole Size | 0.4 mm (through-hole only; no blind vias) |
| Outer Layer Copper Weight | 1 oz (35 μm) |
| Via Plating Thickness | 20 μm |
| Surface Finish | ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) |
| Top Silkscreen | White |
| Bottom Silkscreen | White |
| Top Solder Mask | Green |
| Bottom Solder Mask | Green |
| Electrical Testing | 100% prior to shipment |
| Accepted Quality Standard | IPC-Class-2 |
| Artwork Format | Gerber RS-274-X |
| Global Availability | Worldwide shipping |
Design & Manufacturing Highlights
FR4-Compatible Processing: WL-CT615 can be processed using standard FR4 manufacturing techniques, offering shorter lead times, lower costs, and superior circuit consistency compared to PTFE-based materials.
High-DK Design: With a Dk of 6.15 ± 0.15, this PCB enables significant circuit size reduction, ideal for compact RF and microwave modules.
Fine-Feature Capability: Supports 4/5 mil trace/space and 0.4 mm micro-vias, enabling dense high-frequency circuit layouts.
Green Solder Mask on Both Sides: Provides comprehensive protection for both top and bottom copper layers, ensuring long-term reliability.
White Silkscreen on Both Sides: Clear component identification on both sides facilitates assembly and inspection.
ENEPIG Surface Finish: Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) provides a flat, highly solderable surface with excellent oxidation resistance. The palladium layer prevents nickel corrosion (black pad syndrome), ensuring superior wire bonding capability and long-term reliability – ideal for high-reliability aerospace and defense applications.
Excellent PTH Reliability: With 20 μm via plating and low Z-axis CTE (33 ppm/°C), the PCB offers outstanding plated-through-hole integrity.
Strict Quality Control: Every board undergoes 100% electrical testing and is manufactured to IPC-Class-2 standards, guaranteeing consistent quality and performance.
Typical Applications
Base Station Antennas & Satellite Antennas
Automotive Radar, Sensors & Navigation Systems
Power Amplifiers
Satellite High-Frequency Heads
RF Devices & Filters
WiMAX Antennas & Distributed Antennas
Phased Array Antennas & Beamforming Networks
Aerospace & Defense Equipment
Conclusion
As a specialized supplier of custom high-frequency circuit boards, we combine the proven performance of Wangling WL-CT615 – a thermosetting hydrocarbon/ceramic laminate with exceptional thermal stability, FR4-compatible processing, and high reliability – with our precision manufacturing capabilities to deliver world-class PCB solutions. Our 2-layer offering fully leverages WL-CT615's high dielectric constant (6.15), low loss (0.0040 @ 10 GHz), high Tg (>280°C), copper-matched CTE, and superior thermal conductivity (0.72 W/m·K), ensuring your most demanding RF, aerospace, and defense designs achieve optimal performance and reliability.
Whether you are developing automotive radar systems, satellite communication payloads, base station antennas, or high-power RF amplifiers, our engineering team is ready to support your project.
For technical consultations, samples, or volume orders, please contact us today.
We look forward to being your trusted partner in high-frequency innovation.
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