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High Quality High Conductive Insulation Thermal Silicone Pad Cooling Gap Filler For Semiconductor, Medical Equipment, Mask Aligner

Categories Thermal Gap Filler
Brand Name: ZIITEK
Model Number: TIF100-06S Series
Certification: UL and RoHs
Place of Origin: China
MOQ: 1000pcs
Price: negotiation
Supply Ability: 100000pcs/day
Delivery Time: 3-5 work days
Packaging Details: 1000pcs/bag
Products name: High Quality High Conductive Insulation Thermal Silicone Pad Cooling Gap Filler For Semiconductor, Medical Equipment, Mask Aligner
Keywords: Thermal Silicone Pad
Thickness: 0.020"(0.5mm)~0.200"(5.0mm)
Sample: Sample free
Thermal conductivity: 1.5W/m-K
Continuous Use Temp: -45 to 200℃
Color: White
Hardness: 45 Shore 00
Application: Semiconductor, Medical Equipment, Mask Aligner
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High Quality High Conductive Insulation Thermal Silicone Pad Cooling Gap Filler For Semiconductor, Medical Equipment, Mask Aligner

High Quality High Conductive Insulation Thermal Silicone Pad Cooling Gap Filler For Semiconductor, Medical Equipment, Mask Aligner


The TIF®100-06S Series is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.


Features


> Good thermal conductive: 1.5W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Outstanding thermal performance
> High tack surface reduces contact resistance
> RoHS compliant
> UL recognized


Applications


> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU

> Display card
> Mainboard/mother board
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Routers
> Medical Devices
> Auditioning electronic products
> unmanned aerial vehicle(UAV)


Typical Properties of TIF®100-06S Series
PropertyValueTest method
ColorWhite******
Construction &CompostionCeramic filled silicone elastomer******
Thickness range0.020"(0.5mm)~0.200"(0.50mm)ASTM D374
Specific Gravity2.3g/ccASTM D297
Hardness45 Shore 00ASTM 2240
Continuos Use Temp-45 to 200℃******
Dielectric Breakdown Voltage> 5500 VACASTM D149
Dielectric Constant4.5 MHzASTM D150
Volume Resistivity1.0 X1012 Ohm-meterASTM D257
Flame rating94 V0UL E331100
Outgassing(TML)0.35%ASTM E595
Thermal conductivity1.5 W/m-KASTM D5470

Product Specification

Product Thicknesses: 0.020-inch to 0.200-inch (0.5mm to 5.0mm)
Product Sizes: 8" x 16"(203mm x406mm)

Individual die cut shapes and custom thickness can be supplied, Please contact us for comfirming.


Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated


Company profile


Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.


Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL


Why Choose us ?


1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.

China High Quality High Conductive Insulation Thermal Silicone Pad Cooling Gap Filler For Semiconductor, Medical Equipment, Mask Aligner factory
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