Good Heat Dissipation  Thermal Conductive Silicone Gel Thermal Gap Filler Gel For Telecom Industry

Ziitek TIF^®050-11-1 is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TIF^®050-11-1 is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices.

Feature

> Thermal conductivity: 5.0 W/mK
> Low stress, protect sensitive components.
> Strong plasticity. good stability
> Superior dielectric properties

Application

> Power module
> LED backlight module, LED lighting
> High speed hardware driver
> Micro heat pipe
> Vihicel enginee controller
> Telecom industry
> Semiconductor automatic laboratory equipment

Product Specification

30 cc/pc, 98 pc/box; 300 cc/pc 6 pc/box

Custom packaging available for automation use. Please contact us for confirming.
If you want to know our thermal products, please visit our website.

Independent R&D team

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A:1. Click the "Sent messages" button to continue with the process.

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FAQ

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Q: Do you offer free samples ?

A: Yes, we are willing to offer free sample.

Q:Is there promotion price for big buyer?

A:Yes, we do have promotion price for big buyer. Please send us email for inquiry.