| Sign In | Join Free | My chinacomputerparts.com |
|
| Categories | High Frequency PCB |
|---|---|
| Brand Name: | xingqiang |
| Model Number: | As Per Customer's Model |
| Certification: | ISO 9001 / RoHS /UL / IATF 16949 (automotive) |
| Place of Origin: | China |
| MOQ: | Sample,1 pc(5 square meters) |
| Price: | Based on Gerber Information |
| Payment Terms: | ,T/T,Western Union |
| Supply Ability: | 100000㎡/Month |
| Delivery Time: | NA |
| Packaging Details: | Vacuum Sealed Packaging |
| Pcb Type: | High Frequency PCB |
| Quality: | 100% E-Test |
| Testing Method: | Flying Probe |
| Solder Mask: | yellow+green |
| Customizable Files: | Gerber Files |
| Dielectric Constant: | 3.0 |
| Raw Material: | PTFE/Rogers/Isola |
| Pcb Thickness: | 1.6mm or Customized |
| Regular Layer: | 2/4/6/8/10L or Tailored |
| Silkscreen Colour: | White/based on your request |
| Pcb Surface Finishing: | ENIG/Hard Gold Plating/ENEPIG |
| Company Info. |
| Dongguan Xingqiang Circuit Board Technology Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
High-Frequency PCBs for 5G, Radar, Satellite & High-Speed Digital Circuits:
Our High-Frequency Printed Circuit Board (PCB) is precision-manufactured for demanding applications in RF, microwave, 5G communication, radar systems, satellite technology, and high-speed digital circuits. Designed to minimize signal loss, maintain impedance integrity, and ensure stable performance at GHz-level frequencies, this PCB is ideal for engineers and manufacturers in advanced electronic fields.Whether you're developing 5G base stations, automotive radar, or high-speed data transmission modules, our high-frequency PCB delivers exceptional dielectric performance, low insertion loss, and consistent signal integrity.
Brief Description of HDI PCB Advantages:
1.High Wiring Density: Achieved through the use of Microvias (tiny, laser-drilled holes)
and finer lines/spaces. This allows for significantly more
circuitry in a smaller area, maximizing space utilization.
2. Superior Electrical Performance: The shorter trace lengths and optimized stack-up inherent in HDI
designs lead to better signal integrity, reduced signal latency,
and improved impedance control, which is crucial for high-speed
digital circuits.
3. Miniaturization and Weight Reduction: By increasing integration, HDI boards enable the design of
smaller, lighter, and thinner final products, making them ideal for
smartphones, wearables, and other portable devices.
4. Support for Advanced Packaging: They can accommodate components with very fine pitch, such as BGAs
(Ball Grid Arrays) and CSPs (Chip-Scale Packages), often using
Via-in-Pad technology for better component mounting reliability.
Ordering Information:
1. Gerber files (RS-274X),PCB thickness, ink color, surface
treatment process.
2. BOM (if PCBA or SMT process is needed)
3. Impedance requirements & stack-up (if available)
4.Test requirements (TDR, network analyzer, etc.)
We’ll reply within 24 hours with a free quote, DFM report, and material recommendation.
Manufacturing process:

Factory showcase

PCB Quality Testing

Certificates and Honors


|