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6 Layer HDI Printed Circuit Boards Thick Copper Clad Design Custom Size

Categories High Density Interconnect PCB
Brand Name: xingqiang
Model Number: As Per Customer's Model
Certification: ISO 9001 / RoHS /UL / IATF 16949 (automotive)
Place of Origin: China
MOQ: Sample,1 pc(5 square meters)
Price: Based on Gerber Files
Payment Terms: ,T/T,Western Union
Supply Ability: 100000㎡/Month
Delivery Time: NA
Product: HDI Printed Circuit Boards
Min Hole Size: 0.1mm
Material: High Tg FR-4
Minimum Line Space: 3mil (0.075mm)
Pcba Standard: IPC-A-610E
Surface Treament: OSP/ENIG/ ENEPIG
Special Thick: 2.0/0.6/0.4/0.2
THT/SMT: SMD, BGA, DIP, Etc.
Normal Board Thinkness: 1.6/1.2/1.0/0.8mm
Production Files: Gerber Files/BOM(Pcba)
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  • Company Profile

6 Layer HDI Printed Circuit Boards Thick Copper Clad Design Custom Size

1.6-layer HDI Thick Copper Board PCB

HDI PCB, short for High-Density Interconnect Printed Circuit Board, is a high-precision circuit board that adopts microvias (blind vias, buried vias, stacked vias, etc.), fine conductors (usually line width/space ≤ 4mil/4mil) and advanced lamination technology. Its core feature is to achieve higher circuit density and component integration within a limited board space, which can meet the development needs of electronic devices for "miniaturization, lightweight, and high performance". It is widely used in fields such as 5G communications, medical imaging, smart wearables, automotive electronics, and aerospace. Compared with traditional PCBs, HDI PCBs can significantly reduce the board size (usually by 25%-40%) by reducing the diameter of vias and optimizing the interlayer connection method, while improving signal transmission speed and stability, and reducing electromagnetic interference.


3.Industry-Specific Applications

  • 5G & Telecommunications: 5G small cells, base station transceivers, and optical modules—handles high-frequency signals (sub-6GHz/mmWave) without interference.
  • Medical Equipment: MRI scanners, portable ECG monitors, and dental imaging devices—medical-grade materials ensure biocompatibility and compliance with ISO 13485.
  • Automotive Electronics: ADAS (Advanced Driver Assistance Systems), in-vehicle infotainment, and EV battery management—resists vibration (10-2000Hz) and humidity (85℃/85%RH, 1000h).
  • Aerospace & Defense: UAV (drone) flight controllers, satellite communication modules—meets MIL-STD-202G for shock, temperature, and altitude resistance.



4. Material & Reliability

Material/StandardSpecificationAdvantage for Global Buyers
Base SubstrateFR-4 (Tg 170-220℃) / High-Tg PI (for high-temperature scenarios)Withstands -55℃~150℃ operating temperature; compatible with lead-free soldering (260℃ peak)
Copper Foil0.5oz~3oz (electrodeposited/rolled)Ensures low resistance (≤0.003Ω/sq) for high-current applications (e.g., automotive power modules)
Surface FinishENIG (Immersion Gold: 3-5μm Au) / OSP / HASLENIG provides 1000+ contact cycles (ideal for connectors);OSP suits low-cost, high-volume consumer electronics




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PCB Quality Testing



Certificates and Honors

China 6 Layer HDI Printed Circuit Boards Thick Copper Clad Design Custom Size factory
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