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Custom Printed Circuit Board Manufacturer Electronic PCB SMT/DIP Assembly

Custom Printed Circuit Board Manufacturer Electronic PCB SMT/DIP Assembly

♦ What Is SMT Assembly?

SMT Assembly (Surface-Mount Technology Assembly) is the core process in mobile-phone PCB production where every tiny chip, resistor, capacitor, connector, etc. is placed and soldered onto the bare board without through-holes. In short, it turns the etched copper substrate into a functional circuit.

♦ What Is DIP Assembly?

DIP Assembly (Dual In-line Package Assembly) is the through-hole step that comes after SMT in mobile-phone PCB production. Components whose leads are too large, need high mechanical strength, or carry high current (e.g., big connectors, shielding frames, some inductors, early-stage camera modules, or legacy ICs) are inserted into pre-drilled holes and then wave-soldered or hand-soldered to the board.

♦ Types of PCB Assembly Services:

- Turnkey PCB Assembly: Full service (PCB fabrication + component sourcing + assembly).
- Partial (Consignment) Assembly: Customer provides components; the assembler handles soldering.
- Prototype Assembly: Low-volume assembly for testing designs.
- High-Volume Production: Mass production for commercial devices.

DQS Electronic Group is one of the leading EMS company in China, we provide PCB design, PCB manufacturing, PCB assembly service and testing. Welcome send us your Gerber file to get free quotation. Our email: info@dqspcba.com

♦ Technical Parameters

PCB Assembly Capability
Item				Normal	Special
SMT Assembly	PCB(used for SMT) specification	Length and Width( L* W)	Minimum	L≥3mm, W≥3mm	L＜2mm
		Length and Width( L* W)	Maximum	L≤800mm, W≤460mm	L ＞ 1200mm, W＞500mm
		Thickness( T)	Thinnest	0.2mm	T＜0.1mm
		Thickness( T)	Thickest	4 mm	T＞4.5mm
	SMT components specification	Outline Dimension	Min size	0201(0.6mm*0.3mm)	01005(0.3mm*0.2mm)
			Max size	200 * 125	200 * 125
			component thickness	T≤15mm	6.5mm＜T≤15mm
		QFP,SOP,SOJ (multi pins)	Min pin space	0.4mm	0.3mm≤Pitch＜0.4mm
		CSP/ BGA	Min ball space	0.5mm	0.3mm≤Pitch＜0.5mm
DIP Assembly	PCB specification	Length and Width( L* W)	Minimum	L≥50mm, W≥30mm	L＜50mm
		Length and Width( L* W)	Maximum	L≤1200mm, W≤450mm	L≥1200mm, W≥500mm
		Thickness( T)	Thinnest	0.8mm	T＜0.8mm
		Thickness( T)	Thickest	3.5mm	T＞2mm

♦ Application Fields


PCBA Prototype	Industrial Control PCBA	Telecom PCBA	Medical PCBA

Automotive PCBA	Consumer Electronic PCBA	LED PCBA	Security PCBA

♦ Advantages of DQS Team

On-time Delivery:

- Owned PCBA factories 15,000 ㎡
- 13 fully automatic SMT lines
- 4 DIP assembly lines

2. Quality Guaranteed:

- IATF, ISO, IPC, UL standards
- Online SPI, AOI, X-Ray Inspection
- The qualified rate of products reach 99.9%

3. Premium Service:

- 24H reply your inquiry
- Perfect after-sales service system
- From prototype to mass production

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Categories	PCB Assembly
Certification:	ISO, UL, IPC, Reach
MOQ:	1
Payment Terms:	T/T
Supply Ability:	Post-soldering 700,000 points/day
Delivery Time:	5-30 days
Layer:	8 Layer
Material:	FR4
Board Thickness:	0.2-10mm
Surface Finish:	Immersion Gold
Pin Space:	0.2mm
Application:	Medical