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| Categories | Advanced Packaging Equipment |
|---|---|
| Support 360° Rotation: | Yes |
| Substrate Thickness: | 0.1~9mm |
| Brand Name: | Mingseal |
| Model Number: | FS600A |
| Certification: | ISO CE |
| Place of Origin: | China |
| MOQ: | 1 |
| Price: | $28000-$150000 / pcs |
| Payment Terms: | L/C,D/A,D/P,T/T,Western Union |
| Supply Ability: | 30-40 sets/month |
| Delivery Time: | 5-60 Days |
| Packaging Details: | Wooden Case |
| Dimensions: | 770×1200×1450mm |
| Company Info. |
| Changzhou Mingseal Robot Technology Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
The FS600 Series Inline Visual Dispensing Machine is an intelligent, cost-efficient solution developed specifically for Dam & Fill processes and SiP (System in Package) semiconductor packaging. With an optimized price-performance ratio, this inline dispensing system delivers the high precision and stability that advanced microelectronics manufacturers demand—without the premium price tag of traditional cleanroom equipment.
Targeted at applications where dam structures (e.g., solder dam or epoxy dam) and fill encapsulation must be controlled to micro-level accuracy, the FS600 integrates dedicated process modules for inline inspection. During Dam creation, real-time cameras and sensors measure glue width and bead height to maintain perfectly formed barriers around sensitive dies and circuits. For Fill, the machine precisely controls filling volume to prevent voids and ensure reliable protection for high-density chip packaging.
✔ Dam & Fill encapsulation for SiP packaging
✔ Solder dam lines for die and wire protection
✔ Fill processes for void-free encapsulation of stacked chips
✔ BGA/CSP edge sealing
✔ Corner glue or underfill for advanced PCBA modules
✔ Inline process control with glue width/thickness measurement
✔ Smart factory traceability with MES docking
Frame Structure | Floor-mounted gantry 3-axis | |
Dimensions W×D×H (w/o Loading & Unloading) | 770×1200×1450mm | |
Weight | 800kg | |
Power Supply | 220V AC 50Hz | |
Power | 2.8 kW | |
Dustproof Level | Class100 | |
ESD | Optional | |
Working Environment Temperature | 23℃ ± 5℃ | |
Relative Humidity of Working Environment | 20 ~ 90% | |
Motion System | Transmission Mechanisms | X/Y: Linear motor Z: Servo motor & Screw module |
Repeatability | X/Y: ±0.01mm Z: ±0.005mm | |
Positioning Accuracy | X/Y: ±0.015mm Z: ±0.01mm | |
Max. Movement Speed | X/Y: 1300mm/s Z:500mm/s | |
Max. Accelerated Velocity | X/Y: 1.3g Z: 0.5g | |
Work platform parameters | Visual Positioning Method | Mark/Product appearance features |
Weighing Accuracy | 0.1/0.01mg | |
Track Load-bearing Capacity | 3 kg | |
Track Width Adjustment Range (Single track) | 35~520 mm | |
Substrate Thickness | 0.1~9 mm | |
Minimum Board Edge Gap | 4 mm | |
Z axis Motion Range | 40 mm | |
Dispensing range (W×D) | Max. Dispensing Range -with Loading & Unloading (Single track) | 280×170 mm |
Double Valve Synchronous-w/o compensation-Manual adjustment (Single track/Double track) | 220×520 mm /220×215 mm | |
Double Valve Asynchronous (Single track/Double track) | 315×520 mm / 315×215 mm | |
Left-right Tilt Rotation (Single track/Double track) | 180×480 mm / 180×195 mm | |
Back & forth Tilt Rotation (Single track/Double track) | 280×425 mm / 280×165 mm | |
360° Rotation (Single track/Double track) | 240×455 mm / 240×180 mm | |
The FS600A operates on a floor-mounted gantry 3-axis motion platform driven by X/Y linear motors and a Z-axis servo motor with screw module. Its closed-loop vision system uses dual cameras to detect fiducial marks and edge deviations, enabling real-time path correction with ±0.01mm repeatability. During Dam creation, inline cameras continuously measure glue width and bead height, ensuring each barrier stays within specified tolerances. For Fill processes, the system precisely controls dispensing volume to eliminate voids. The machine supports single-valve, dual-valve synchronous, and dual-valve asynchronous configurations, along with tilt rotation and 360° rotation options for complex 3D dispensing paths. Integrated SMEMA interfaces and MES-ready data logging enable seamless smart factory deployment.
1. Precision Requirements: Verify that repeatability (±0.01mm) and positioning accuracy (±0.015mm) meet your chip packaging tolerance specifications, especially for fine-pitch SiP applications.
2. Substrate Compatibility: Confirm the track width adjustment range (35–520mm) and substrate thickness capability (0.1–9mm) cover your full product portfolio.
3. Throughput Needs: Single-valve configurations suit R&D or low-volume runs; dual-valve synchronous/asynchronous modes double output for high-volume production lines.
4. Adhesive Compatibility: Ensure the system handles your specific glue types (solder paste, epoxy, silicone, underfill) under consistent thermal and flow conditions.
5. Facility Integration: Check dustproof level (Class100), ESD requirements, and MES/SMEMA interface availability for your existing line infrastructure.
6. Dispensing Range: Match the maximum dispensing area (280×170mm standard, expandable with tilt/rotation) to your largest substrate dimensions.
Q1: Why is inline Dam width/thickness monitoring important?
A: Precise dam structures prevent overflow and protect delicate
chip areas. The FS600’s real-time measurement module ensures each
bead stays within tolerance, reducing rework.
Q2: How does Fill volume monitoring help yield?
A: By verifying fill amount inline, voids are prevented,
guaranteeing stronger encapsulation—crucial for SiP reliability and
thermal cycling performance.
Q3: Is the FS600 only for cleanroom lines?
A: No. While suitable for semi-clean or standard SMT environments,
its mineral-cast frame ensures vibration damping and dust control,
so you get near cleanroom results at a fraction of the cost.
Q4: Can I integrate this with my MES?
A: Absolutely. The FS600 Series comes MES-ready with SMEMA standard
interfaces, easy inline linking, and real-time data logging for
full traceability.
Mingseal specializes in high-precision inline and desktop dispensing solutions for semiconductors, SiP, MEMS, SMT, and next-gen electronics. With thousands of installations worldwide, we help factories push the limits of process control, yield, and smart automation—while always delivering solid ROI and robust local support.
Contact us today to see how the FS600 Series can upgrade your Dam & Fill production line for less.
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