Sign In | Join Free | My chinacomputerparts.com
chinacomputerparts.com
Products
Search by Category
Home > Electronic Data Systems >

8-Layer Heavy Copper PCB TU-865 (TG180/TG200) Halogen-Free

Categories Multilayer PCB
Brand Name: Bicheng
Model Number: BIC-332.V1.0
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Price: USD9.99-99.99
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
PCB material: TU-865 halogen-free FR4 substrate
Layer count: 8-layer
PCB thickness: 4.5mm
PCB size: 120mm × 120mm (1PCS)
Solder mask: Green
Silkscreen: White
Copper weight: All layers: 10oz (350μm) finished heavy copper
Surface finish: Immersion Gold
  • Haven't found right suppliers
  • Our buyer assistants can help you find the most suitable, 100% reliable suppliers from China.
  • And this service is free of charge.
  • we have buyer assistants who speak English, French, Spanish......and we are ready to help you anytime!
Submit Buying Request
  • Product Details
  • Company Profile

8-Layer Heavy Copper PCB TU-865 (TG180/TG200) Halogen-Free

This PCB is an 8-layer heavy-copper circuit board built with TU-865 high-Tg halogen-free substrate. Featuring extreme 10oz (350μm) finished copper on every single layer and a total board thickness of 4.5mm, this ultra-thick copper PCB delivers exceptional current carrying capacity and thermal dissipation performance. It adopts double-sided green solder mask with white silkscreen and premium immersion gold surface finishing. Equipped with complex manufacturing technologies including buried vias, blind vias, half-cut holes and conductive copper paste filled vias, this rigid multilayer board is engineered for harsh industrial environments and high-current power applications such as automotive electronics, server power supplies and base station infrastructure.


PCB Specifications

Construction ItemDetails
Base MaterialTU-865 halogen-free FR4 substrate (Tg 180℃ / Max Tg 200℃), high-reliability epoxy glass material for harsh environment applications
Layer Count8 layers – Heavy copper multilayer PCB customized for high-current power transmission
Board Dimensions120mm × 120mm (1PCS), compact square layout for industrial power module assembly
Finished Board Thickness4.5mm ultra-thick lamination structure, enhancing mechanical strength and heat dissipation efficiency
Copper WeightAll layers: 10oz (350μm) finished heavy copper, consistent thick copper design for extreme current load
Surface FinishImmersion Gold, providing excellent oxidation resistance, stable conductivity and long-term shelf life
Silkscreen & Solder MaskTop & Bottom: Green Solder Mask with White Silkscreen, clear marking and reliable insulation protection
Special Complex StructureBlind vias, buried vias, half-cut holes; All through holes filled with conductive copper paste for enhanced connectivity and thermal conductivity
Quality Testing100% continuity, impedance and void inspection for copper paste filled holes to ensure industrial-grade stability

Artwork Format & Compliance Standard

Artwork Format: Supplied in Gerber RS-274-X, universal industrial standard for precise heavy copper fabrication.


Quality Standard: Compliant with IPC-Class-2, suitable for long-term uninterrupted operation of industrial power equipment.


Availability: Global shipping service to support international industrial and automotive procurement projects.



Introduction of TU-865 Substrate

TU-865 is a high-performance halogen-free FR-4 laminate composed of epoxy resin and E-glass fabric, developed for harsh industrial environments and high-reliability electronic applications. With a maximum Tg up to 200℃, this mid-loss material integrates phosphorus and nitrogen compounds to achieve UL94V-0 flame retardant grade without halogen, antimony and red phosphorus additives. Compatible with AOI inspection process and equipped with UV-blocking characteristics, TU-865 perfectly adapts to automated industrial production lines.


Matched with dedicated TU-865P prepreg, this material supports complex multilayer lamination. It features low thermal expansion coefficient, ultra-low moisture absorption rate, outstanding chemical resistance and superior dimensional stability. TU-865 provides excellent CAF anti-migration capability and strong tolerance for lead-free soldering thermal cycling, making it ideal for products requiring repeated high-temperature assembly and extreme environmental resistance.


Key Material Features

ParameterSpecification & Remarks
Glass Transition Temperature (Tg)180℃ (Standard) / 200℃ (Max), high thermal resistance for lead-free soldering
Flame Retardant GradeUL94 V-0, secure fireproof performance for industrial equipment
Material PropertyHalogen-free, Antimony-free, Environmental friendly green substrate
Moisture Absorption Rate0.13%, excellent moisture resistivity for humid working conditions
Process CompatibilityAOI process compatible & UV-blocking characteristic
Special PerformanceAnti-CAF capability, low CTE, superior chemical & dimensional stability

Key Benefits

TU-865 high-Tg halogen-free substrate delivers irreplaceable advantages for heavy copper power PCBs:


Green environmental formula: halogen, antimony and red phosphorus free, compliant with global environmental protection standards


Ultra-high Tg property resists thermal deformation during multiple high-temperature soldering processes


Low thermal expansion coefficient ensures stable dimension under severe temperature cycling


Excellent moisture and chemical resistance adapts to complex and harsh working environments


Powerful CAF resistance effectively prevents conductive anodic filament corrosion failure


Perfect compatibility with lead-free assembly processes for standardized industrial manufacturing


Typical Applications

This 8-layer 10oz heavy copper TU-865 PCB is widely applied in high-power and high-reliability industrial fields:


Automotive electronic systems and harsh environment vehicle control modules


High-power server power supply boards and energy storage management units


Telecommunication equipment and cellular base station power backplanes


Industrial heavy-current control equipment and high-power inverter circuitry


Automation industrial control boards requiring long-term continuous operation


China 8-Layer Heavy Copper PCB TU-865 (TG180/TG200) Halogen-Free factory
Send your message to this supplier
 
*From:
*To: Bicheng Electronics Technology Co., Ltd
*Subject:
*Message:
Characters Remaining: (0/3000)
 
Inquiry Cart 0