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TIS800K Semiconductor Electrical Insulating Sheet Thermal Conductive Silicone Gasket Sil Pad For IGBT Mosfet

Categories Thermal Insulation Materials
Brand Name: Ziitek
Model Number: TIS800K
Certification: UL and RoHs
Place of Origin: Vietnam
MOQ: 1000pcs
Price: 0.1-10 USD/PCS
Payment Terms: T/T
Supply Ability: 100000pcs/day
Delivery Time: 3-5 work days
Packaging Details: 24*13*12cm cartons
Products name: TIS800K Semiconductor Electrical Insulating Sheet Thermal Conductive Silicone Gasket Sil Pad For IGBT Mosfet
Color: Beige
Thickness range(inch/mm): 0.006/0.152
Density: 2.4g/cc
Keywords: Thermal Conductive Insulating
Construction & Compostion: Ceramic Filled Silicone Elastomer / Polyimide Film
Thermal Conductivity: 1.3W/mK
Continuous use temp: -60~180℃
Application: Power Semiconductors
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TIS800K Semiconductor Electrical Insulating Sheet Thermal Conductive Silicone Gasket Sil Pad For IGBT Mosfet

TIS800K Semiconductor Electrical Insulating Sheet Thermal Conductive Silicone Gasket Sil Pad For IGBT Mosfet


TIS®800K series is a thermal silicone product featuring a ceramic-filled layer coated on a polyimide film, offering excellent thermal conductivity and heat transfer performance. The TIS®800K model is designed for screw-mounted applications on device openings, with the composite polyimide film providing superior dielectric insulation. Its soft thermal coating enhances gap-filling capability and improves handling during assembly.

Features

>Relatively soft surface,good thermal conductivity
>High voltage insulation, low thermal resistance
>Tear-resistant and puncture-resistant

Applications

>Power supplies and automotive battery packs
>Power semiconductor devices
>Audio-visual products
>Charging stations

Typical Properties of TIS®800K series
Product NameTIS®806KTIS®808KTIS®810KTest Method
ColorLight AmberVisual
Polyimide Film Thickness(inch/mm)0.001"/0.025mmASTM D374
Total Thickness0.006"/0.152mm0.008"/0.203mm0.010"/0.254mm
Density (g/cc)2.0ASTM D297
Tensile Strength (Mpa)10ASTM D412
Recommended Operating Temperature (℃)-45 to 160℃***
Dielectric Breakdown Voltage (VAC)650070007500ASTM D149
Dielectric Constant3.8ASTM D150
Volume Resistivity(Ohm-cm)3.5X10¹³ASTM D257
Flame Rating94 V0equivalent UL
Thermal conductivity1.3 W/mK 

Standard Thickness: 0.006" (0.152 mm), 0.008" (0.203 mm), 0.010" (0.254 mm)
For other thickness options, please contact us.

Standard Size: 10" x 100' (254 mm x 25.4 m).The TIS®800K series can be die-cut into various shapes for supply.

Packaging Details & Lead time


The packaging of Thermal Insulation Materials

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Company profile
With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

Independent R&D team


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A:1. Click the "Sent messages" button to continue with the process.

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