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TO63-03A Hermetic Sealing Package for Power Devices

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Brand Name: HUONA
Model Number: top
Certification: ISO9001
Place of Origin: CHINA
MOQ: 100
Price: Bargain
Payment Terms: T/T
Supply Ability: 100000 A WEEK
Delivery Time: A WEEK
Packaging Details: Case
Housing Material: Kovar alloy or 304 stainless steel
Number of Pins: 3 pins (customizable to 4, 6,8 etc.)
Plating Options: Nickel, Gold (0.5–2μm thickness)
Glass Insulator: Borosilicate or high-insulation custom glass
Hermeticity: ≤1×10⁻⁸ atm·cc/sec (He leak test)
Dimensional Customization: Available upon customer drawings
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TO63-03A Hermetic Sealing Package for Power Devices

Product Overview

Product Name: TO63-03A Hermetic Sealing Package
Model Number: TO63-03A
Package Type: TO-style metal can (Transistor Outline)
Sealing Technology: Glass-to-Metal Sealing (GTMS)
Materials:

  • Housing: Kovar alloy (Fe-Ni-Co) or stainless steel

  • Pins: Kovar, Dumet, or custom conductive materials

  • Insulation Medium: Borosilicate or high-insulation glass


Key Features & Advantages

  • Excellent hermeticity with leak rate ≤1×10⁻⁸ atm·cc/sec (helium leak test), suitable for aerospace, defense, and high-reliability applications

  • Wide temperature range from -55°C to +300°C for use in extreme environments

  • Strong mechanical structure with high resistance to vibration and shock

  • Effective thermal path through the TO-style metal base, ideal for power components and heat-sensitive devices

  • Full customization available: pin configuration, plating thickness, housing size, materials, etc.


Technical Specifications (Customizable)

ItemSpecification / Range
Housing MaterialKovar alloy or 304 stainless steel
Number of Pins3 pins (customizable to 4, 6,8 etc.)
Plating OptionsNickel, Gold (0.5–2μm thickness)
Glass InsulatorBorosilicate or high-insulation custom glass
Hermeticity≤1×10⁻⁸ atm·cc/sec (He leak test)
Operating Temp.-55°C to +300°C
Surface FinishNickel plated, gold plated, or blackened
Dimensional CustomizationAvailable upon customer drawings
PackagingVacuum sealed, anti-static bag, foam tray

Application Fields

  • Laser diode and VCSEL packaging

  • Infrared sensor and detector modules

  • Power electronics: IGBT, MOSFET, and high-current transistors

  • RF and microwave device packaging

  • Medical sensor modules requiring hermetic enclosures

  • Aerospace, defense, and industrial electronics


Available Documentation & Support

  • 2D/3D drawings in PDF or STEP format

  • Helium leak and material composition reports

  • RoHS and REACH compliance certificates

  • OEM/ODM customization available from prototype to volume

  • Technical consulting for packaging layout, sealing process, and thermal design

  • Our R & D department design your product following your own specifcations

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China TO63-03A Hermetic Sealing Package for Power Devices factory
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