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Custom Multilayer HDI Interconnect PCB Circuit Board 0.4mm Half Plating Vias

Categories HDI PCB
MOQ: 1
Price: Contact Us
Payment Terms: T/T
Supply Ability: 200,000+ m² PCB per Month
Layer: 10 layers
Material: Fr4
Thickness: 2.0 mm
Construction: 2+N+2
Min. Line Width/Space: 0.1/0.1mm
Surface Treatment: Immersion Gold
Type: Customizable
Application: Medical Device
Standard: UL&IPC Standard &ISO
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Custom Multilayer HDI Interconnect PCB Circuit Board 0.4mm Half Plating Vias


10 Layer Multilayer HDI Circuit Board 0.4mm Half Plating Vias PCB


♦ What ​​is Blind Hole in PCBs?


Half Plating Vias​​ (also called ​​Partial Plating Vias​​ or ​​Non-Through Plating Vias​​) are a type of via structure used in printed circuit board (PCB) design where the conductive plating does not fully extend through the entire via hole.


​​Key Characteristics:​​

    1. ​​Partial Copper Plating​​:

      • Unlike standard ​​fully plated through-hole vias​​, half-plated vias have copper plating only on one side or a portion of the via wall, leaving the other side unplated or partially plated.
    2. ​​Controlled Depth Plating​​:

      • The plating may stop at a certain depth, either by laser drilling, controlled electroplating, or plugging material (e.g., resin).
    3. ​​Common Applications​​:

      • ​​Blind/Buried Vias​​: Used in HDI (High-Density Interconnect) PCBs to connect inner layers without passing through the entire board.
      • ​​Via-in-Pad Designs​​: Helps prevent solder wicking into the via during assembly.
      • ​​RF/Microwave PCBs​​: Reduces parasitic capacitance and improves signal integrity.
      • ​​Thermal Management​​: Used in thermal vias to control heat dissipation.

Manufacturing Methods:​

    • ​​Laser Drilling + Plating​​: Laser creates a cavity, followed by selective plating.
    • ​​Plugging & Partial Plating​​: Filling part of the via with dielectric material before plating.
    • ​​Sequential Lamination​​: Used in HDI PCBs to create buried or blind half-plated vias.


♦ ​​​​Comparison with Other Via Types?​


​Via Type​​Plating Coverage​​Usage​
​Through-Hole Via​Fully plated (entire hole)Standard PCBs
​Blind Via​Plated from surface to inner layerHDI PCBs
​Buried Via​Plated between inner layersMultilayer PCBs
​Half Plating Via​Partially plated (one side or depth-controlled)Specialized designs

♦ ​​Conclusion

Half plating vias are an advanced PCB design technique used to optimize space, signal performance, and manufacturability in complex multilayer boards, especially in high-frequency and miniaturized electronics.


Technical Parameters


Item

Spec

Layers

1~64

Board Thickness

0.1mm-10 mm

Material

FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base,Ceramic, etc

Max Panel Size

800mm×1200mm

Min Hole Size

0.075mm

Min Line Width/Space

Standard: 3mil(0.075mm) Advance: 2mil

Board Outline Tolerance

士0.10mm

Insulation Layer Thickness

0.075mm--5.00mm

Out Layer Copper Thickness

18um--350um

Drilling Hole (Mechanical)

17um--175um

Finish Hole (Mechanical)

17um--175um

Diameter Tolerance (Mechanical)

0.05mm

Registration (Mechanical)

0.075mm

Aspect Ratio

17:01

Solder Mask Type

LPI

SMT Min. Solder Mask Width

0.075mm

Min. Solder Mask Clearance

0.05mm

Plug Hole Diameter

0.25mm--0.60mm


One-Stop PCBs Solution

PCB PrototypeFelx PCBRigid-Flex PCBCeramic PCB
Heavy Copper PCBHDI PCBHigh Frequency PCBHigh TG PCB

Advantages of DQS Team
  1. On-time Delivery:
    • Owned PCBA factories 15,000 ㎡
    • 13 fully automatic SMT lines
    • 4 DIP assembly lines

2. Quality Guaranteed:

    • IATF, ISO, IPC, UL standards
    • Online SPI, AOI, X-Ray Inspection
    • The qualified rate of products reach 99.9%

3. Premium Service:

    • 24H reply your inquiry
    • Perfect after-sales service system
    • From prototype to mass production

China Custom Multilayer HDI Interconnect PCB Circuit Board 0.4mm Half Plating Vias factory
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