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| Categories | Thick Copper PCB | 
|---|---|
| MOQ: | 1 | 
| Price: | Send us Gerber file for free quotation | 
| Payment Terms: | T/T | 
| Layer: | 14 Layer | 
| Material: | Polyimide | 
| Thickness: | 1.5mm | 
| Copper Thickness: | 4OZ | 
| Surface Treatment: | ENIG | 
| Max. Line Width/Space: | 2.54/1.27mm | 
| Application: | Automotive Electronics | 
| Certificate: | UL,IATF16949,ISO&Reach | 
| Company Info. | 
| DQS Electronic Co., Limited | 
| Verified Supplier | 
| View Contact Details | 
| Product List | 
High-performance Substrate Polyimide Thick Copper PCB Multilayer Copper Stacked PCB Board
♦ What is Thick copper PCB?
Thick copper PCB refers to a circuit board formed by bonding a layer of copper foil with a thickness of 2 ounces (oz, about 62.5 microns) or more to FR-4 or other substrates during the printed circuit board (PCB) manufacturing process.
♦ Features of Thick Copper PCB
Large current carrying capacity: copper thickness ≥3oz, can pass 100A+ current, low temperature rise.
Strong heat dissipation: high thermal conductivity, heat dissipation efficiency increased by 5 times+, temperature rise reduced by 10-15℃.
High mechanical strength: bending resistance increased by 50%, high temperature vibration resistance, adaptable to harsh environments.
Electrical stability: low impedance, low loss, low risk of delamination at high temperature.
Flexible design: supports wide line width (≥100mil) and multi-layer thick copper stacking.
Complex process: etching/drilling is difficult, yield rate is 85%-90%.
High cost: material + processing premium is 30%-50%, and the unit price is high.
♦ Applications of Thick Copper PCB
♦ Technical Parameters
Item  | Specification  | 
Laers  | 1~32  | 
Board thickness  | 0.1mm-7.0mm  | 
Material  | FR-4,CEM-1/CEM-3,PI,High Tg,Rogers  | 
Max panel size  | 32"×48"(800mm×1200mm)  | 
Min hole size  | 0.075mm  | 
Min line width  | 3mil(0.075mm)  | 
Surface finish  | OSP,HASL,Imm Gold/Nickel/Ag, Electric gold  | 
Copper thickness  | 0.5-7.0OZ  | 
Soldermask  | Green/Yellow/Black/White/Red/Blue  | 
Silkscreen  | Red/Yellow/Black/White  | 
Min PAD  | 5mil(0.13mm)  | 
Inter package  | Vacuum  | 
Outer package  | Carton  | 
Outline tolerance  | ±0.75mm  | 
Hole tolerance  | PTH:±0.05 NPTH:±0.025  | 
Certificate  | UL,ISO 9001,ISO14001,IATF16949  | 
Special request  | Blind hole+Gold finger + BGA  | 
Material Suppilers  | Shengyi, KB, Nanya, ITEQ,etc.  | 
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