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| Categories | Pick And Place Machine |
|---|---|
| Brand Name: | GKG |
| Model Number: | GD602D |
| Certification: | CE |
| Place of Origin: | China |
| MOQ: | 1 |
| Price: | 26000 |
| Payment Terms: | T/T |
| Supply Ability: | The production capacity is 30 units a month |
| Delivery Time: | 20-25 |
| Packaging Details: | Vacuum packing plus wooden box packing |
| Application: | COB flexible Strip light |
| Name: | Flip Chip Die Bonder |
| Maximum board size: | 152MMX152MM |
| Condition: | Original new |
| Usage: | SMD LED SMT |
| core components: | PLC, Engine, Bearing, Gearbox, motor, Pressure vessel, Gear, Pump |
| Brand: | GKG |
| Company Info. |
| Shenzhen Hongxinteng Technology Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
Product Features
1. Utilizes a sheet-to-sheet docking station with dual swing arms
for 180° cross-bonding.
2. Compatible with a printer to enable a variety of in-line process solutions.
3. Fully integrated carrier from loading, printing, to die bonding and placement.
4. The carrier supports 0.5M materials, and mid-process transfers are accomplished using a docking station.
5. Equipped with a variety of practical features, including automatic calibration, automatic die ring changer, and a feeder-style quick-release workbench.
| Speed of die attach | ≥60ms UPH: 60K/h (actual production capacity depends on wafer and substrate size and process requirements) |
| Position accuracy of die attach | ± 1 mil (± 25um) |
| Angle accuracy of wafer | ± 1 ° |
| Crystal loss detection function | With (vacuum detection mode) |
| Solid leakage detection function | With (vacuum detection mode) |
| Capacity statistics function | Yes |
| Statistical function of consumables usage | Yes |
| Function of parameter modification record | Yes |
| User privilege management function | Yes |
| Module of wafer worktable | |
| Size of the chip | 3milx5mil-60mlx60mil |
| Thickness of the wafer | 0.1-0.7 mm |
| Maximum correction angle of wafer | ± 15 ° |
| Maximum size of wafer and wafer ring | 6“Crystal Ring (152 mm outer diameter) .” |
| Maximum area size of wafer | 4.7“(119 mm) |
| Maximum travel of worktable | 152MMX152MM |
| XY resolution | 0.5 um |
| Thimble height travel in z direction | 3 mm |
| Thimble cap | Single Needle (with) |
| Motor and drive system | Home-made linear motor & Huichuan District Drive |
| Image recognition system | |
| Methods of image recognition | 256 grayscale |
| Image resolution | 720 * 540 |
| Accuracy of image recognition | ± 0.025 Mil@50 Mil observed range |
| Foolproof function of chip | Yes |
| Pre-consolidation testing function | Yes |
| Post-consolidation image detection function | Yes |
| Mode of feeding | Automatic connection of incoming and outgoing materials |
| Solid Crystal Swing Arm System | |
| The way of fixing crystal | Double Swing Arm 180 ° rotation solidification |
| Suction pressure of crystal | 30g-250g adjustable |
| Manual adjustment of suction nozzle vacuum sensitivity | Yes |
| Module of substrate workbench | |
| Mounting speed | 5000-6000UPH |
| Range of travel of worktable | 140mmx620mm |
| Adapt to the width of the substrate | 60-120mm |
| Adapt to the length of the substrate | 100-600mm |
| Thickness of substrate | 0.1-2mm |
| XY resolution | 0.5um |
| Motor and drive system | Home-made Linear Motor & Huichuan District Drive |
| Fixing method of base plate | Manipulator plus vacuum suction platform |
Product application
COB flexible lamps are mainly used in smart home, intelligent
lighting, car decoration, intelligent decoration and other
applications.
Applicable products: Flexible Lamp Belt (FPC, PCB, BT) , SMD, resistors, IC components and other flip-chip products solid crystal.
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