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| Categories | Aluminum Oxide Ceramic |
|---|---|
| Brand Name: | KEGU |
| Place of Origin: | China |
| Price: | 200-500 yuan/kg |
| Payment Terms: | L/C,D/A,D/P,T/T,Western Union,MoneyGram |
| Supply Ability: | 2,000 pcs/month |
| Packaging Details: | Strong wooden box for Global shipping |
| Model Number: | Customizable |
| Material: | SiC |
| Composition:SiC: | ＞85% |
| Color: | Black |
| Density: | ≥3.65g/cm3 |
| Max. Service Temp: | 1380℃ |
| Flexural Strength: | 250MPa |
| Hardness: | ≥84HRA |
| Water Absorption: | ≤0.2% |
| Abrasion: | < 0.02% |
| Bending strength: | ≥290MPa |
| Company Info. |
| Shaanxi KeGu New Material Technology Co., Ltd |
| Verified Supplier |
| View Contact Details |
| Product List |
Sphercial Alumina Powder Fot High Thermal Conductive Material
This product is a spherical alumina powder with high globularity with high thermal conductivity, developed by high temperature melting technologies and indicates excellent characteristics for rubber and plastic filler and ceramic base material.
Specifications:
Type | D50(um) | S.S.A.(m2/g) |
SA-05 | 5±1 | 0.60 |
SA-10 | 10±2 | 0.50 |
SA-20 | 20±3 | 0.40 |
SA-30 | 30±3 | 0.30 |
SA-40 | 40±5 | 0.20 |
SA-70 | 70+/-6 | 0.12 |
Physical Property:
| Appearance | White powder |
| Specific Gravity (g/cm3) | 3.60 |
| Melting point (℃) | 2050 |
| Moisture (%) | ≤ 0.05 |
| EC(uS/cm) | ≤ 10 |
| PH | 7.0±0.5 |
| α-Al2O3 Cotent(%) | ≥ 90 |
| Spherical particles ratio(%) | ≥ 95 |
Chemical Property:
| Type | Chemical Composition | ||||||
| Al2O3% ≥ | SiO2% ≤ | Fe2O3% ≤ | Na2O%≤ | K2O% ≤ | MgO%≤ | CaO% ≤ | |
| SA-05 | 99.0 | 0.05 | 0.05 | 0.03 | 0.02 | 0.01 | 0.01 |
| SA-10 | 99.0 | 0.05 | 0.05 | 0.03 | 0.02 | 0.01 | 0.01 |
| SA-20 | 99.0 | 0.05 | 0.05 | 0.02 | 0.01 | 0.01 | 0.01 |
| SA-30 | 99.0 | 0.05 | 0.05 | 0.02 | 0.01 | 0.01 | 0.01 |
| SA-40 | 99.0 | 0.05 | 0.05 | 0.02 | 0.01 | 0.01 | 0.01 |
| SA-70 | 99.0 | 0.05 | .05 | 0.02 | 0.01 | 0.01 | 0.01 |
Character:
2. High thermal conductivity: High filling density enables production of compounds with higher thermal conductivity and higher heat dissipation rate compared to crystalline silica.
3. Low abrasivity: Due to its Spherical shape, less-wearing of kneading machines, forming machines and dies.
Applications:
1. Filler for heat sink sheet, filler for heat dissipation board (MC board), heat dissipating
grease, phase change sheet
2. Filler for semiconductor sealing resin
3. Silicone-based heat dissipating adhesive, filler for compound
4. Ceramic filler
Quality control:
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