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TIF030AB-05S Two Component Liquid Easily Thermal Gap Filling Material Silicone Thermal Gel For Power Semiconductor

Categories Thermal Conductive Gel
Brand Name: Ziitek
Model Number: TIF030AB-05S
Certification: RoHS
Place of Origin: Vietnam
MOQ: 1000 pcs
Price: 0.1-10 USD/PCS
Payment Terms: T/T
Supply Ability: 100000pcs/month
Delivery Time: 3-5 work days
Packaging Details: 25*14*13cm carton
Products name: Two Component Liquid Easily Thermal Gap Filling Material Silicone Thermal Gel For Power Semiconductor
Thermal conductivity: 3.0W/mK
Keywords: Thermal gel
Hardness: 65 Shore 00
Specific Gravity: 3.1g/cm³
Continuous Use Temperature: -45~200℃
Color: White / Blue
Application: Power Semiconductor
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TIF030AB-05S Two Component Liquid Easily Thermal Gap Filling Material Silicone Thermal Gel For Power Semiconductor

TIF030AB-05S Two Component Liquid Easily Thermal Gap Filling Material Silicone Thermal Gel For Power Semiconductor


TIF030AB-05S is a highly thermal conductive, liquid gap filling material. It is provide with two-component and different temperature curing system. The product was supplied as highly thermal conductive, soft and elastomer for coupling on electrical devices modul. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components. It is liquid approach offer variety of thickness, replacing individual die-cut and specific pad thickness. Different from grease, the cured product is dry and can be touch. It can intented for use in thermal applications.


Feature

< Good thermal conductive: 3.0W/mK
< UL recognized
< Naturally tacky needing no further adhesive coating
< Two-part formulation for easy storage
< High durability
< Optimized shear thinning characteristics for ease of dispensing

Applications

< Notebook
< Set top boxes
< Monitoring the Power Box
< High speed mass storage drives
< Heat sink any heat generating semiconductor


Typical Properties of TIF030AB-05S Series
Uncured Material Properties
PropertyNumericalTest Method
Color/Part AWhiteVisual
Color/Part BBlueVisual
Part A Viscosity (mPa.s)900,000 cpsGB/T 10247
Part B Viscosity (mPa.s)1,500,000 cpsGB/T 10247
Flow Rate (g/min)25Ziitek Test Method
Density3.1g/ccASTM D297
Bond Line thickness (mm)0.2Ziitek Test Method
Thermal resistance @10psi(℃•in2/W)0.75ASTM D5470
Thermal resistance @50psi(℃•in2/W)0.45ASTM D5470
Mix Ratio0.042361111******
Shelf Life12 months******
Cure Schedule
Pot Life @25℃30minZiitek Test Method
Cure @25℃16hrsZiitek Test Method
Cure @70℃30minZiitek Test Method
Cure Material Properties
ColorBlueVisual
Hardness65 shore00ASTM D2240
Continuous Use Temp-45~200℃Ziitek Test Method
Break Voltage≥5500ASTM D149
Flame Rating94V0UL E331100
Thermal Conductivity3.0W/MkASTM D5470

Product packing details:
50cc/pc, 48pcs/box; 400cc/pc, 9pcs/box
We offer the custom packaged in Syringes for automated despensing applications. Please contact us for confirming.

Company Profile


Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!


Independent R&D team


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A:1. Click the "Sent messages" button to continue with the process.

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4. We will reply you as soon as possible with Email or online


FAQ


Q: Are you trading company or manufacturer?

A: We are manufacturer in Vietnam.


Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.


Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

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