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| Categories | EMMC Memory Card |
|---|---|
| Brand Name: | PG |
| Model Number: | G25128TLAEC |
| Place of Origin: | China |
| Price: | Negotiable |
| Payment Terms: | L/C, T/T |
| Supply Ability: | 100K a month |
| Delivery Time: | 10 to 15 days |
| Capacity: | 8GB/16GB/32GB/64GB/128GB/256GB |
| Agreement: | HS400 |
| Read speed: | Up to 330MB/s |
| Write speed: | Up to 240MB/s |
| Operating temperature: | -40℃~+85℃/-45℃~+105℃ |
| Choice of Flash: | 3DTLC |
| Company Info. |
| China Chips Star Semiconductor Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
Model | G2564GTLAEC | G25128TLAEC | G25256TLAEC | G25512TLAEC |
NAND flash | 3DTLC NAND | 3DTLC NAND | 3DTLC NAND | 3DTLC NAND |
Capacity | 64GB | 128GB | 256GB | 512GB |
CE | 1 | 2 | 4 | 4 |
Read speed | up to 330MB/s | up to 330MB/s | up to 330MB/s | up to 330MB/s |
Write speed | up to 240MB/s | up to 240MB/s | up to 240MB/s | up to 240MB/s |
Operating temperature | -45℃~105℃ | -45℃~105℃ | -45℃~105℃ | -45℃~105℃ |
EP | ≥5000 | ≥5000 | ≥5000 | ≥5000 |
Packaging specification | BGA 153 | BGA 153 | BGA 153 | BGA 153 |
Size | 11.5mmx13mmx1.0mm | 11.5mmx13mmx1.0mm | 11.5mmx13mmx1.2mm | 11.5mmx13mmx1.2mm |
High durability
Wide temperature operating range
Earthquake resistance and vibration resistance
High reliability and stability
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