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| Categories | FR4 PCB |
|---|---|
| Brand Name: | Hansion |
| Model Number: | FR4 double side PCBA |
| Place of Origin: | China |
| MOQ: | 1 |
| Price: | 5 |
| Payment Terms: | Western Union,T/T |
| Supply Ability: | 10000PCS per month |
| Delivery Time: | 3-5days |
| Packaging Details: | foam+custom box |
| Silkscreen Color: | White, Black, Yellow |
| Material: | FR4 |
| Minimum Trace/Space: | 4/4 mil |
| Copper Thickness: | 1/2 oz, 1 oz, 2 oz |
| Surface Finish: | HASL, ENIG, OSP, Immersion Silver, Immersion Tin |
| Layer: | 2-16 layers |
| Minimum Hole Size: | 0.2 mm |
| Solder Mask Color: | Green, Blue, Black, Red, Yellow, White |
| product name: | HS-FR4 PCBA 001 |
| Company Info. |
| Shenzhen Hansion Technology Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
Description | Technology & Capabilities | ||||
1. Product Range | Rigid PCBs from 2- 24 layers, HDI; Aluminium base | ||||
2. Min. Board Thickness | 2 layer | 4 layer | 6 layer | 8 layer | 10 layer |
min. 0.2 mm | 0.4 mm | 1 mm | 1.2 mm | 1.5 mm | |
12 & 14 layer | 16 layer | 18 layer | 20 layer | 22 & 24 layer | |
1.6 mm | 1.7 mm | 1.8 mm | 2.2 mm | 2.6 mm | |
3. Max. Board Size | 610 x 1200 mm | ||||
4. Base Material | FR-4 Glass Epoxy laminate, Aluminium base, RCC | ||||
5. Surface Finish Treatment | Electroless nickel Immersion gold ( Electoless Ni/Au). Organic
Solerability Preservatives ( OSP or Entek). Hot Air Leveling (
Lead- Free, RoHS). Carbon Ink. Peelable Mask. Gold Fingers.
Immersion Silve. Immersion Tin. Flash gold ( Electrolytic) | ||||
6. Major Laminate | King Boad (KB-6150). ShengYi (S1141; S1170). Arion. YGA-1-1; Rogers
and others. | ||||
7. Via Holes | Copper PTH/ Blind Via/ Buried Via/ HDI 2+N+2 with IVH | ||||
8. Copper Foil Thickness | 18um/ 35um/ 70um~245um (outer layer 0.5oz~7oz) 18um/ 35um/ 70um~ 210um (inner layer 0.5oz~6oz) | ||||
9. Min. Via Size and Type | Dia. 0.15mm (Finished). Aspect Ratiao = 12; HDI holes (＜0.10mm) | ||||
10. Min. Line Width & Spacing | 0.75 mm/ 0.10mm ( 3mil/ 4mil) | ||||
11. Min Via Hole Size & Pad | Via: Dia, 0.2mm/ pad. dia. 0.4mm; HDI＜0.10mm via | ||||
12. Impedance I Control Tol. | +/- 10% ( min. +/- 7 Ohm) | ||||
13. Solder Mask | Liquid Photo- Image (LPI) | ||||
14. Profiling | CNC Routing, V- Cutting, Punching, Push back punching, Connector
chamfering | ||||
15. Capacity | 100 k㎡ output monthly | ||||
FAQ:
Question 1.Are you pcba factory?
Answer:yes of course.
Question 2:Does your factory provide one stop service?
Answer:Yes of course we have purchase department and designer.
Question 4:can you provide me sample to test before mass order?
Answer:Yes of course
Question 5:how about your package?are you sure that i will receive the prefect goods without damage?
Answer:we provide custom foam box to protect the product.
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