Customized COG LCD Display Dot Matrix Liquid Crystal Display FSTN Transflective

We support OEM Services, all details can be customized.

Such as sizes, LCD types, display modes, polarizer types, viewing angles, working voltage, drive methods, connectors, backlights, temperature, etc.

Pls share your sketches/ drawings, and we will help to evaluate the costs and provide some suggestions for your reference.

Notices: What are the differences between COG and COB technology?

COG, Chip On Glass technology, directly binds the driver chip to the glass, which has the characteristics of transparency.

COB, Chip On Board technology, is to adhere the bare chip to the interconnect substrate with conductive or non-conductive glue, and then perform wire bonding to achieve its electrical connection.

Features of LCD packaged with COG technology:

1. Simplified process. Directly bond the IC to the conductive electrode of the LCD screen, reducing the welding process;

2. The volume is much smaller than COB (Chip On Board), which is easier to miniaturize, simplify, and highly integrated. The PCB circuit is directly made on the LCD screen, so it is widely used in portable complete products that need to reduce the volume, such asPDAs, MP3s, watches, information phones, handheld instruments, etc.；

3. Directly flip-chip bond the IC to the LCD screen, and there is no problem with IC deformation.

COB LCD packaging method and its characteristics:

1. If the bare chip is directly exposed to the air, it can easily be polluted or damaged by human beings, which will affect or destroy the chip's function. Therefore, the chip and bonding wire are encapsulated with glue. People also call this packaging from soft encapsulation.

2. The bare chip encapsulated by COB technology has the chip body and I/O terminals above the crystal. During welding, the bare chip is bonded to the PCB with conductive/thermal conductive glue. After solidification, the metal wire (Al or Au) is connected to the chip's I/O terminal welding area and the corresponding pad of the PCB by a Bonder machine under the action of ultrasound and hot pressing. After passing the test, the resin glue is sealed.

3. Compared with traditional packaging technology, COB technology has the following advantages: low price; space-saving; and mature technology.

4. COB technology also has shortcomings, that is, it needs to be equipped with a welding machine and a packaging machine, and sometimes the speed cannot keep up; PCB patch has more stringent environmental requirements; it cannot be repaired, etc.

Applications:

Our LCDs are widely used in medical equipment, instrumentation, industrial equipment, communication devices, smart homes, electrical appliances, financial products, toys, new energy control panels, automotive applications, and more.