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High-Power Electronic Devices Alumina Ceramic Substrates With Heat Dissipation And Superior Insulation

Categories Alumina Ceramic
Place of Origin: Made In China,Zhejiang,Jinhua
Brand Name: Dayoo
MOQ: Negotiate
Price: Negotiate
Delivery Time: Negotiable
Payment Terms: Negotiable
Transparency: Opaque
Bulk Density: >3.63
Method: lsostatic presure
Tensile Strength: 250 MPa
Alumina Content: 92% & 95%
Mechanical Strength: Very High
Hardness: 9 Mohs
Dielectric Constant: 9.8
Dimensional Tolerance: ±0.001 mm
Precision Tolerance: High
Maximum Operating Temperature: 1,500°C
Surface Finish: Polished
Type: Nozzles
Properties: electric insulation
Size: Customized
Packaging Details: Carton
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High-Power Electronic Devices Alumina Ceramic Substrates With Heat Dissipation And Superior Insulation

High-Power Electronic Devices Alumina Ceramic Substrates with Heat Dissipation and Superior Insulation

Product Introduction

Our alumina ceramic insulation heat sink substrates are manufactured from 99.6% high-purity alumina material, specifically engineered for thermal management and electrical insulation requirements in high-power electronic devices. Featuring excellent thermal conductivity (24-30W/(m·K)) and ultra-high insulation strength (>15kV/mm), with precision-polished surfaces achieving roughness below Ra 0.1μm, these substrates represent the ideal solution for high-temperature, high-power applications including power semiconductors, LEDs, and IGBT modules.

Primary Applications

  • Power Electronics: IGBT modules, MOSFETs, thyristor heat sinks

  • LED Lighting: High-power LED chip packaging substrates

  • New Energy Vehicles: Motor controllers, charging pile power modules

  • 5G Communications: Base station power amplifier heat sinks

  • Industrial Control: Frequency converters, servo drive power units

Key Advantages

Efficient Heat Dissipation: Thermal conductivity up to 30W/(m·K), 10× better than standard PCBs
Superior Insulation: Breakdown voltage >15kV/mm, volume resistivity >10¹⁴Ω·cm
High-Temperature Resistance: Continuous operation up to 850°C
Dimensional Stability: CTE 7.2×10⁻⁶/℃, excellent match with chips
Precision Machining: Flatness ≤0.02mm/50mm, laser-cuttable

Technical Specifications

ParameterStandard (96%)High-Performance (99.6%)
Al₂O₃ Content96%99.6%
Thermal Conductivity (W/(m·K))2430
Flexural Strength (MPa)300400
Dielectric Constant (1MHz)9.59.2
Thickness Range (mm)0.25-5.00.25-5.0
Maximum Size (mm)150×150150×150

Precision Manufacturing Process

  1. Powder Preparation: High-purity alumina powder (D50≤0.8μm)

  2. Tape Casting: Precise slurry viscosity and thickness control

  3. Isostatic Pressing: 200MPa high-pressure densification

  4. Atmosphere Sintering: 1650°C hydrogen-protected sintering

  5. Precision Machining: Double-side grinding + laser cutting

  6. Surface Treatment: CMP polishing to Ra 0.1μm

  7. Full Inspection: AOI + insulation testing

Installation Guidelines

Professional Recommendations:

  • Soldering temperature <280°C, duration <10 seconds

  • Apply thermal grease to enhance thermal contact

  • Avoid mechanical impact and localized stress concentration

  • Storage humidity <60% RH

  • Recommend regular insulation checks (every 5,000 hours)

Service Commitment

  • Technical Support: Thermal simulation analysis services

  • Rapid Response: 48-hour expedited delivery for standard sizes

  • Customization: Special shapes and metallization treatments available

  • Failure Analysis: SEM+EDS testing laboratory equipped

Technical FAQ

Q: How to select proper substrate thickness?
A: 0.63mm recommended for general power devices, ≥1.0mm for high-power applications

Q: Is double-side metallization possible?
A: Supports thick-film printing, thin-film sputtering, DBC and other metallization processes

Q: How to ensure reliability in vibration environments?
A: Recommend our patented edge reinforcement structure design



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