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FR4 TG135 Double Layer PCB Board 0.8MM Immersion Gold Surface

Categories 2 Layer PCB
Brand Name: WITGAIN PCB
Model Number: PCB00030
Certification: UL
Place of Origin: China
MOQ: 1 pcs/lot
Price: negotiable
Payment Terms: T/T
Supply Ability: 100k pcs/month
Delivery Time: 10 days
Packaging Details: Vacuum bubble bag packaging
No of layers: 2 Layer
Material: FR4 TG>135
PCB Thickness: 0.8 MM
Solder mask colour: Green
Surface technics: Immersion Gold
CU Thickness: 1OZ
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FR4 TG135 Double Layer PCB Board 0.8MM Immersion Gold Surface

FR4 TG135 Double Layer PCB Board Immersion Gold


  • Main Features:

1 2 Layer FR4 substrate material printed circuit board.

2 Double layer copper, copper thickness is 35um/35um.

3 Finished pcb thickness is 0.8 mm.

4 Surface Treatment is immersion gold 1u'.

5 Used in consumer products.

6 2 layer pcb with 8/8mil min line space and width.

7 Green solder mask and white silkscreen.

8 Need customer to send us the gerber file or PCB file


  • Our Capabilities:
NOItemCapability
1Layer Count1-24 Layers
2Board Thickness0.1mm-6.0mm
3Finished Board Max Size700mm*800mm
4Finished Board Thickness Tolerance+/-10% +/-0.1(<1.0mm)
5Warp<0.7%
6Major CCL BrandKB/NanYa/ITEQ/ShengYi/Rogers Etc
7Material TypeFR4,CEM-1,CEM-3,Aluminum,Copper, Ceramic, PI, PET
8Drill Hole Diameter0.1mm-6.5mm
9Out Layer Copper Thickness1/2OZ-8OZ
10Inner Layer Copper Thickness1/3OZ-6OZ
11Aspect Ratio10:1
12PTH Hole Tolerance+/-3mil
13NPTH Hole Tolerance+/-1mil
14Copper Thickness of PTH Wall>10mil(25um)
15Line Width And Space2/2mil
16Min Solder Mask Bridge2.5mil
17Solder Mask Alignment Tolerance+/-2mil
18Dimension Tolerance+/-4mil
19Max Gold Thickness200u'(0.2mil)
20Thermal Shock288℃, 10s, 3 times
21Impedance Control+/-10%
22Test CapabilityPAD Size min 0.1mm
23Min BGA7mil
24Surface TreatmentOSP, ENIG,HASL, Plating Gold, Carbon Oil,Peelable Mask etc

  • FQA:

Q1: What is thermal resistance? How can the thermal resistance of a PCB be reduced?


A1: Thermal Resistance is a property of a printed circuit board that specifies its resistance to heat dispersion. A low thermal resistance in a PCB makes the dispersion of heat easier. This is basically the inverse of thermal conductivity. The thermal resistance of a PCB can be calculated by evaluating all the layers of the board and the heat parameters of the material.


To find the total thermal resistance for your board, you must include all layers of the board and the associated heat parameters for the type of material through which heat will flow.


[Formula]

R_theta = absolute thermal resistance (K/W) across the thickness of the sample

Delta x = thickness (m) of the sample (measured on a path parallel to the heat flow)

k = thermal conductivity (W/(K·m)) of the sample

A = cross-sectional area (m2) perpendicular to the path of heat flow


In addition to the thermal resistance of the board. The Thermal resistance of Vias must also be calculated. This usually depends on the copper trance, the laminate and the substrate and their respective thermal resistivities.

How can you reduce the Thermal Resistance of a PCB?

  • Thermal resistance can be reduced by increasing the thickness of the copper traces.
  • Another method to decrease the thermal resistance is to place copper pads below the hot components. The high thermal conductivity of copper provides a low resistance path for the dispersion of heat. These pads can be connected to an internal ground plane through vias, which have good thermal conductivity and thus help move heat away from the component.
  • Using Heat Sinks can help lower the thermal resistivity of the board.

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