10M08SAM153I7G Programming IC Chip Field Programmable Gate Array (FPGA)153-VFBGA

10M08SAM153I7G Programmable IC Chip
Field Programmable Gate Array (FPGA) IC 112 387072 8000 Package 153-VFBGA

Number of LABs/CLBs	500
Number of Logic Elements/Cells	8000
Total RAM Bits	387072
Number of I/O	112
Voltage - Supply	2.85V ~ 3.465V
Mounting Type	Surface Mount
Operating Temperature	-40°C ~ 100°C (TJ)
Package / Case	153-VFBGA
Supplier Device Package	153-MBGA (8x8)

• Improved Core Logic Performance: The Intel Hyperflex core architecture combined with Intel’s 14 nm tri-gate technology allows Intel Stratix 10 TX devices to achieve 2X the core performance compared to the previous generation
• Lower Power: Intel Stratix 10 TX devices use up to 70% lower core power compared to the previous generation, enabled by 14 nm Intel tri-gate technology, the Intel Hyperflex core architecture, and optional power savings features built into the architecture
• Higher Density: Intel Stratix 10 TX devices offer over two times the level of integration, with up to 2,800K logic elements (LEs) in a monolithic fabric, 94.5 Mbits of embedded eSRAM blocks in select devices, over 229 Mbits of embedded M20K memory blocks, and 11,520 18x19 multipliers
• Embedded Processing: Select Intel Stratix 10 TX devices feature a Quad-Core 64-bit Arm Cortex-A53 processor optimized for power efficiency and software compatible with previous generation Intel SoCs
• Improved Transceiver Performance: With up to 144 transceiver channels implemented in heterogeneous 3D SiP transceiver tiles, Intel Stratix 10 TX devices support data rates up to 57.8 Gbps PAM4 and 28.9 Gbps NRZ for chip-to-chip and backplane driving with signal conditioning circuits capable of equalizing over 30 dB
of system loss.

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Sai Collie Technology Co., Ltd. is a leading independent supplier and distributor of electronic components, 2007, We have been focusing on providing original equipment manufacturers (OEMs) and contract electronics manufacturers (CEMs), which are hard to find, obsolete and hot-selling integrated circuits, semiconductors, etc.

After years of development, we have formed a complete electronic components supply and distribution system.

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