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| Categories | Multilayer Printed Circuit Board |
|---|---|
| Brand Name: | JIETENG |
| Model Number: | PCBA |
| Certification: | ISO/TS16949/RoHS/TS16949 |
| Place of Origin: | Guangdong, China |
| MOQ: | Negotiable |
| Price: | Negotiable |
| Payment Terms: | Negotiable |
| Supply Ability: | 200000 Piece/Pieces per Month |
| Delivery Time: | 3-10 daysDelivery within |
| Packaging Details: | 1.Inner: PCB: Vacuum Packing PCBA: ESD Packing 2.Outer: Standard export carton 3.Customized package. |
| Base Material:: | FR-4, FR-4 |
| Copper Thickness: | 1/2 oz min; 12 oz max |
| Board Thickness: | 0.2mm-6mm(8mil-126mil) |
| Min. Line Width: | 0.075mm(3mil) |
Event data recorder PCBA solution development APP writing PCB High Frequency Board
| PCB Manufacture Capacity | |
| Item | Specification |
| Material | FR-4, FR1,FR2; CEM-1, CEM-3,Rogers, Teflon,Arlon,Aluminum Base, Copper Base,Ceramic, Crockery, etc. |
| Remarks | High Tg CCL is Available(Tg>=170℃) |
| Finish Board Thickness | 0.2 mm-6.00mm(8mil-126mil) |
| Surface Finish | Gold finger(>=0.13um), Immersion Gold(0.025-0075um), Plating Gold(0.025-3.0um), HASL(5-20um), OSP(0.2-0.5um) |
| Shape | Routing,Punch,V-cut,Chamfer |
| Surface Treatment | Solder Mask(black, green, white, red, blue, thickness>=12um, Block, BGA) |
| Silkscreen(black, yellow, white) | |
| Peel able-mask(red, blue, thickness>=300um) | |
| Minimum Core | 0.075mm(3mil) |
| Copper Thickness | 1/2 oz min; 12oz max |
| Min Trace Width & Line Spacing | 0.075mm/0.075mm(3mil/3mil) |
| Min Hole Diameter for CNC Drilling | 0.1mm(4mil) |
| Min Hole Diameter for Punching | 0.6mm(35mil) |
| Biggest panel size | 610mm * 508mm |
| Hole Position | +/-0.075mm(3mil) CNC Drilling |
| Conductor Width(W) | +/-0.05mm(2mil) or +/-20% of original |
| Hole Diameter(H) | PTHL:+/-0.075mm(3mil) |
| Non PTHL:+/-0.05mm(2mil) | |
| Outline Tolerance | +/-0.1mm(4mil) CNC Routing |
| Warp & Twist | 0.70% |
| Insulation Resistance | 10Kohm-20Mohm |
| Conductivity | <50ohm |
| Test Voltage | 10-300V |
| Panel Size | 110 x 100mm(min) |
| 660 x 600mm(max) | |
| Layer-layer misregistration | 4 layers:0.15mm(6mil)max |
| 6 layers:0.25mm(10mil)max | |
| Min spacing between hole edge to circuitry pattern of an inner layer | 0.25mm(10mil) |
| Min spacing between board outline to circuitry pattern of an inner layer | 0.25mm(10mil) |
| Board thickness tolerance | 4 layers:+/-0.13mm(5mil) |
|
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